Stacked RGB Pixel Circuits for High-Density Panel Stability
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Solution Overview
Problem
Reducing pixel size in electronic device panels to increase pixel density leads to deterioration in stability and performance of the pixel circuit.
Innovation Solution
A panel design where red, green, and blue pixel circuits are stacked along the thickness direction of the substrate, with each circuit overlapping a significant portion of the corresponding optoelectronic element, using two-dimensional materials and thin film transistors, and separated by insulation layers to maintain performance and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If pixel size is reduced to increase pixel density, then resolution is improved, but stability and performance of pixel circuit deteriorates
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement of pixel circuits to a three-dimensional stacked configuration. Multiple pixel circuits are arranged in vertical layers along the thickness direction of the substrate, allowing each circuit to occupy a smaller footprint area while maintaining adequate circuit area for stable operation. This vertical stacking enables higher pixel density without compromising circuit performance.
Solution Approach 2:
The patent implements a nested structure where multiple pixel circuits are positioned within the vertical space above each other. The first pixel circuit is positioned at a first position, the second pixel circuit at a second position different from the first, creating a nested arrangement that maximizes space utilization. This nested configuration allows compact pixel structures while preserving circuit functionality.
2Area of stationary object
If pixel size is reduced, then area occupied by pixel circuit is reduced, but driving stability deteriorates
Solution Approach 1:
The patent resolves this contradiction by utilizing the thickness dimension to accommodate multiple pixel circuits vertically. Each circuit maintains its required area for stable driving operations, while the vertical stacking reduces the horizontal footprint. This allows the pixel structure to occupy reduced area in the plane while preserving adequate circuit area through the third dimension.
Solution Approach 2:
The patent segments the pixel circuit functionality across multiple vertical layers. Different pixel circuits are positioned at different vertical positions, with each layer containing circuits optimized for specific functions. This segmentation allows distribution of circuit elements across the thickness direction, maintaining stability while reducing overall pixel area.
3Ease of manufacture
If multiple pixel circuits are arranged in the same plane, then manufacturing is simplified, but space utilization is inefficient
Solution Approach 1:
The patent improves space utilization by arranging pixel circuits in the thickness direction rather than only in the plane. Multiple circuits are positioned at different vertical levels, creating a three-dimensional configuration that maximizes space efficiency. This vertical arrangement allows higher pixel density without significantly complicating the manufacturing process, as the stacking follows a systematic layer-by-layer fabrication approach.
Data Source
AI summary
A panel includes: a substrate, unit pixels arranged repeatedly on the substrate, and unit pixel circuits including a unit pixel circuit repeatedly arranged on the substrate and electrically connected to a unit pixel. Each unit pixel includes a red sub-pixel including a red optoelectronic element configured to display red color or detect red light, a green sub-pixel including a green optoelectronic element configured to display green color or detect green light, and a blue sub-pixel including a blue optoelectronic element configured to display blue color or detect blue light. Each unit pixel circuit includes a red pixel circuit electrically connected to the red optoelectronic element, a green pixel circuit electrically connected to the green optoelectronic element, and a blue pixel circuit electrically connected to the blue optoelectronic element. The red pixel circuit, the green pixel circuit, and the blue pixel circuit are stacked along a thickness direction of the substrate.