Stacked SAW Package With Conductive Frame for Heat Dissipation
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Solution Overview
Problem
Acoustic wave filters, particularly surface acoustic wave (SAW) filters, face limitations in thermal dissipation due to poor thermal conductivity of materials like lithium niobate and lithium tantalate, leading to power durability issues and potential device failure at high temperatures.
Innovation Solution
A packaged acoustic wave component is designed with a multi-layer piezoelectric substrate and a thermally conductive frame to direct heat generated by one SAW device to another, enhancing thermal dissipation and power durability by using a support layer with higher thermal conductivity than the piezoelectric layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If stacked SAW packages are used to reduce size, then device miniaturization is achieved, but thermal dissipation performance deteriorates due to lower thermal conductivity in upper wafer
Solution Approach 1:
The piezoelectric substrate is segmented into multiple layers with different thermal conductivities. The first piezoelectric layer has higher thermal conductivity than the second piezoelectric layer, creating a thermal gradient that directs heat flow from the upper device to the lower device, thereby improving thermal dissipation while maintaining the compact stacked structure
Solution Approach 2:
The patent employs composite material structure by combining piezoelectric layers with different thermal conductivities in a stacked configuration. This multi-layer composite approach enables differentiated thermal management where each layer contributes to overall heat dissipation performance while maintaining the necessary piezoelectric functionality
2Power
If high power applications are implemented, then device functionality is enhanced, but thermal stress increases leading to potential device failure
Solution Approach 1:
Different regions of the device structure are assigned different thermal properties. The first piezoelectric layer is designed with higher thermal conductivity specifically to handle heat generation in high power applications, while the second layer maintains necessary piezoelectric characteristics. This localized optimization of thermal properties enables high power operation without compromising device reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the temperature of the first acoustic wave device to below 100 degrees Celsius, preventing mechanical stress and failure, enabling high power applications while allowing for size reduction and improved thermal performance.
Implementation Method 1
a thermally conductive frame interposed between the first and second acoustic wave devices. The first multi-layer piezoelectric substrate is configured to direct heat generated by the first acoustic wave device to the second acoustic wave device by way of the thermally conductive frame to dissipate heat from the first acoustic wave device
Implementation Method 2
A surface acoustic wave resonator can include an interdigital transductor electrode on a piezoelectric substrate. The surface acoustic wave resonator can generate a surface acoustic wave on a surface of the piezoelectric layer on which the interdigital transductor electrode is disposed
Data Source
AI summary
Aspects of this disclosure relate to a method of manufacturing a packaged acoustic wave component with two acoustic wave devices interconnected by a thermally conductive frame. The method includes providing a first acoustic wave device having a multi-layer piezoelectric substrate structure with a first piezoelectric layer disposed over a first support layer and an interdigital transducer electrode. The method further includes stacking the first acoustic wave device relative to a second acoustic wave device such that a thermally conductive frame extends between the first acoustic wave device and the second acoustic wave device. The thermally conductive frame provides a thermal path for heat dissipation from the first acoustic wave device to the second acoustic wave device.