Stacked Semiconductor Package with Bond Pads and Protection Layer
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Solution Overview
Problem
Existing semiconductor packages face challenges in maximizing integration density on printed circuit boards due to size limitations and reduced input/output (I/O) sharing, especially in stacked configurations, which leads to higher test yield loss and inefficiencies in high-frequency applications.
Innovation Solution
A reduced size stackable semiconductor package design featuring a bulk layer with bond pads, an active layer, and a protection layer, allowing for efficient electrical coupling and stacking with interposers or solder balls, maximizing I/O and minimizing space usage through a prescribed pattern of electrical communication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If semiconductor packages are stacked vertically to maximize integration density, then space utilization on printed circuit boards is improved, but test yield loss increases and manufacturing complexity worsens
Solution Approach 1:
The patent transitions from planar packaging to three-dimensional stacked packaging, arranging semiconductor dies vertically in multiple layers. This dimensional change allows maximum utilization of PCB space while maintaining electrical connectivity through vertical interconnect structures, thereby improving space utilization without fundamentally compromising functionality.
Solution Approach 2:
The patent divides the semiconductor package into discrete stacked layers or dies, each potentially containing different functional circuits. This segmentation allows independent testing and assembly of individual layers, which can reduce overall test yield loss compared to testing a single large integrated package, while still achieving high integration density when stacked.
2Productivity
If more devices are integrated into a vertical stack to maximize space usage, then integration density is improved, but test yield loss increases
Solution Approach 1:
By segmenting the integrated system into multiple discrete semiconductor dies that are stacked and interconnected, the patent enables modular assembly where each die can be tested separately before stacking. This reduces the cumulative test yield loss that would occur if all devices were tested as a single integrated unit, while still achieving high integration density through vertical stacking.
Solution Approach 2:
The patent distributes devices across multiple vertical layers rather than integrating them in a single planar layer. This three-dimensional arrangement increases integration density by utilizing the vertical dimension, while the modular layer structure allows for staged testing and assembly processes that can maintain higher overall yield compared to testing a single large-scale integration.
3Reliability
If gold wires and substrates are used to achieve electrical signal routing patterns, then electrical connectivity is improved, but cross torque issues arise that create difficulties in high frequency applications
Solution Approach 1:
The patent replaces traditional mechanical wire bonding (gold wires) with direct semiconductor-to-semiconductor bonding interfaces or integrated interconnect structures embedded within the stacked package. This substitution eliminates the mechanical flexibility and associated cross-torque problems of wire bonds, providing more rigid and stable electrical pathways that perform better in high-frequency applications.
Solution Approach 2:
The patent employs composite interconnect structures that combine multiple materials with complementary properties, such as integrating conductive pathways directly into the semiconductor substrate or using specialized interposer materials that provide both electrical connectivity and mechanical stability. These composite structures reduce cross-torque effects while maintaining reliable electrical connections in high-frequency environments.
Data Source
AI summary
In accordance with the present invention, there is provided multiple embodiments of a reduced size stackable semiconductor package. In a basic embodiment of the present invention, the semiconductor package comprises a bulk layer having at least one first bond pad formed therein. At least one active layer is formed on the bulk layer and electrically coupled to the first bond pad. Additionally, at least one second bond pad is formed on the active layer and is electrically coupled thereto. A protection layer is formed on that surface of the active layer having the second bond pad formed thereon, the protection layer also partially encapsulating the second bond pad. In other embodiments of the present invention, the above-described semiconductor package is provided in a stacked arrangement and in a prescribed pattern of electrical communication with one or more additional, identically configured semiconductor packages. In these stacked arrangements, one or more interposers and/or solder balls may optionally integrated into such semiconductor package stacks. In other embodiments of the present invention, a semiconductor package is provided wherein a semiconductor package stack is itself electrically connected to a substrate and covered with an encapsulant material which ultimately hardens into a package body.