Stacked Semiconductor Device Bonding Pad Layout for Signal Delay Reduction
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Solution Overview
Problem
Conventional semiconductor device packages experience signal delay due to physical length differences in interconnections between stacked semiconductor devices, which affects the operational efficiency of the stacked semiconductor devices.
Innovation Solution
A semiconductor device package with a bonding pad array configuration that includes a signal bonding pad, a control pin bonding pad, and at least one stacking bonding pad adjacent to the control pin bonding pad, minimizing the physical length difference of interconnections by using anisotropic conductive films for electrical connections between stacked semiconductor devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional bonding pad arrays are used in stacked semiconductor devices, then the mounting density and memory storage capacity are improved, but signal delay occurs due to physical length differences in interconnections
Solution Approach 1:
The patent applies local quality by positioning stacking bonding pads at specific locations adjacent to control pin bonding pads, rather than uniformly distributing all bonding pads. This localized arrangement optimizes the interconnection path lengths from control pins to stacking bonding pads across different stacked devices, minimizing signal delay while maintaining high mounting density and memory storage capacity.
2Productivity
If vertically stacked semiconductor device packages are used to increase memory storage capacity, then mounting area use efficiency is improved, but signal delay increases due to physical length differences in interconnections
Solution Approach 1:
The patent implements local quality by strategically positioning stacking bonding pads adjacent to control pin bonding pads in the bonding pad array. This localized configuration ensures that control signals traverse minimized and equalized path lengths through the adhesive material layer to reach stacking bonding pads in vertically stacked devices, thereby reducing signal delay while preserving the high mounting area use efficiency of the stacked package structure.
3Loss of time
If bonding pads are positioned to minimize interconnection length, then signal delay is reduced, but the bonding pad array layout becomes more complex
Solution Approach 1:
The patent applies asymmetry by positioning stacking bonding pads specifically adjacent to control pin bonding pads rather than using a symmetric or uniform distribution pattern. This asymmetric arrangement optimizes signal path lengths from control pins to stacking bonding pads, minimizing signal delay while the systematic nature of placing stacking pads next to control pins maintains reasonable layout complexity for manufacturing.
Data Source
AI summary
This invention provides a semiconductor device. The semiconductor device includes a bonding pad array comprising: a signal bonding pad, a control pin bonding pad and at least one stacking bonding pad on an active surface. At least one stacking bonding pad is adjacent to the control pin bonding pad. This invention also provides a stacked structure of semiconductor devices and/or a semiconductor device package including the semiconductor device.