Stacked Semiconductor Package Using Conductive Adhesive
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Solution Overview
Problem
Conventional methods for forming stacked semiconductor packages are inefficient, resulting in packages that are unnecessarily expensive and large, with issues such as poor adhesion between components and warpage due to thermal expansion, leading to detachment of connection and stacking balls.
Innovation Solution
A stacked semiconductor package and manufacturing method utilizing an adhesive member comprising conductive particles to conductively connect and bond a lower semiconductor package and an interposer, increasing the bond line size and bondability, thereby facilitating electrical signal transmission and preventing warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional methods are used to form stacked semiconductor packages, then the packages can be manufactured, but they result in unnecessarily large dimensions and high cost
Solution Approach 1:
The patent combines multiple functions into a single adhesive member that simultaneously provides mechanical bonding and electrical conduction. The adhesive member integrates both adhesive properties (for bonding the interposer to the package) and conductive properties (for electrical connection), eliminating the need for separate bonding and conductive elements, thus reducing package size and manufacturing complexity
Solution Approach 2:
The adhesive member is designed to perform multiple functions: mechanical bonding between the interposer and package, electrical conduction for signal transmission, and potentially thermal management. This multi-functional approach reduces the number of components needed and simplifies the overall package structure, addressing both size and manufacturing complexity concerns
2Reliability
If conventional bonding methods are used, then components can be connected, but adhesion between components is poor
Solution Approach 1:
The adhesive member is formulated as a composite material containing conductive particles (such as metal particles or carbon particles) dispersed in an adhesive matrix. This composite structure provides both strong adhesion through the adhesive matrix and electrical conduction through the conductive particles, improving reliability while maintaining process simplicity
Solution Approach 2:
The patent modifies the properties of the adhesive material by adjusting the concentration, size, and distribution of conductive particles within the adhesive matrix. By optimizing these parameters, the adhesive member achieves both strong bonding strength and adequate electrical conductivity, improving reliability without complicating the bonding process
3Stability of the object's composition
If stacked packages are formed using conventional methods, then multiple layers can be created, but warpage due to thermal expansion occurs
Solution Approach 1:
The patent addresses thermal warpage by selecting adhesive materials and conductive particles with thermal expansion coefficients that match or are compatible with the adjacent components (package substrate and interposer). This minimizes differential thermal expansion during temperature changes, preventing warpage and maintaining structural stability
Solution Approach 2:
The adhesive member acts as an intermediary layer between the package substrate and interposer, accommodating and absorbing thermal expansion differences between these components. The adhesive's viscoelastic properties allow it to deform under thermal stress without causing warpage, while maintaining the mechanical and electrical connection
4Reliability
If conventional connection methods are used, then electrical connection can be established, but connection and stacking balls detach
Solution Approach 1:
The adhesive member merges mechanical bonding and electrical conduction functions, providing a unified bonding interface that secures the interposer while establishing electrical connections. This eliminates the need for separate ball attachment processes that are prone to detachment, improving connection reliability and ball attachment strength simultaneously
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of conductive particles in the adhesive member enhances the electrical connection and mechanical bonding between semiconductor packages, reducing manufacturing processes and preventing warpage, resulting in a more reliable and compact semiconductor package.
Implementation Method 1
an adhesive member comprising conductive particles is provided between an upper surface of the lower semiconductor package and a lower surface of the interposer so that the adhesive member is conductively connected to the IO terminals of the lower semiconductor package
Implementation Method 2
the adhesive member comprising conductive particles is provided between an upper surface of the lower semiconductor package and a lower surface of the interposer so that the adhesive member is conductively connected to the IO terminals
Data Source
AI summary
A stacked semiconductor package and a manufacturing method thereof. For example and without limitation, various aspects of this disclosure provide a semiconductor package in which an upper interposer and/or package are electrically and mechanically coupled to a lower package utilizing an adhesive member comprising conductive particles.