Stacked Semiconductor Package Heat Dissipation Part Design
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor packages face challenges in heat dissipation, leading to reliability issues and limited integration flexibility due to thermal expansion coefficient mismatches between heat dissipation materials and semiconductor chips, which can cause cracks and damage to integrated circuits.
Innovation Solution
A semiconductor package design featuring a heat dissipation part with a thermal pad and bump on the top surface of the first semiconductor chip, spaced apart from the second semiconductor chip, to efficiently distribute heat and prevent thermal stress, while allowing flexible integration of integrated circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation materials are used in semiconductor packages, then heat dissipation efficiency is improved, but thermal expansion coefficient mismatches cause cracks and damage to integrated circuits
Solution Approach 1:
The patent introduces a buffer layer as an intermediary between the heat dissipation material and the integrated circuit. This buffer layer has a thermal expansion coefficient that is intermediate between the heat dissipation material and the semiconductor chip, thereby reducing the thermal stress and preventing cracks while maintaining effective heat dissipation.
Solution Approach 2:
The patent employs composite material structures where the buffer layer is composed of materials with specific thermal expansion properties that bridge the gap between dissimilar materials. This composite approach allows the system to achieve both high heat dissipation efficiency and mechanical reliability by combining materials with complementary properties.
2Temperature
If heat dissipation part is placed close to integrated circuits for efficient heat transfer, then heat dissipation efficiency is improved, but thermal stress causes cracks and damage
Solution Approach 1:
The buffer layer serves as a protective intermediary that decouples the thermal stress from the integrated circuit while maintaining thermal coupling for efficient heat transfer. This allows the heat dissipation part to be positioned close to the integrated circuit without causing direct thermal stress damage.
Solution Approach 2:
The buffer layer is pre-positioned between the heat dissipation material and the integrated circuit to provide beforehand cushioning against thermal expansion stresses. This preventive measure ensures that when temperature changes occur, the buffer layer absorbs the stress before it can reach and damage the integrated circuit.
3Ease of manufacture
If conventional wire bonding technique is used, then manufacturing simplicity is maintained, but performance and integration flexibility are limited
Solution Approach 1:
The patent extracts the wire bonding step from the manufacturing process and replaces it with a direct mount technique where the integrated circuit is mounted directly to the substrate with electrical connections formed through conductive vias. This extraction eliminates the limitations of wire bonding while maintaining manufacturing feasibility through simplified direct connection methods.
Solution Approach 2:
The patent replaces the mechanical wire bonding system with an electrical connection system based on conductive vias and pads. This substitution eliminates the mechanical constraints of wire bonding (such as wire tension and positioning) while providing greater design flexibility and performance benefits through direct electrical pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances heat dissipation efficiency, prevents thermal damage to integrated circuits, and increases the degree of freedom in arranging integrated circuits by uniformly distributing heat and avoiding thermal stress-induced cracks.
Implementation Method 1
a first heat dissipation part disposed on the top surface of the first semiconductor chip between the first and second semiconductor chips and spaced apart from a bottom surface of the second semiconductor chip
Data Source
AI summary
An embodiment includes a semiconductor package comprising: a substrate; a first semiconductor chip mounted on the substrate; a second semiconductor chip mounted on a top surface of the first semiconductor chip; a connecting bump disposed between the first and second semiconductor chips to electrically connect the second semiconductor chip to the first semiconductor chip; and a first heat dissipation part disposed on the top surface of the first semiconductor chip between the first and second semiconductor chips and spaced apart from a bottom surface of the second semiconductor chip.