Vertically Stacked Semiconductor Assembly With Interposer Heat Isolation
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Solution Overview
Problem
Current semiconductor device assemblies face challenges in heat dissipation, particularly as devices become smaller and faster, leading to increased heat generation that limits performance and reliability, especially when high-performance logic devices like GPUs are used in conjunction with memory devices, resulting in inefficient heat transfer and increased footprint.
Innovation Solution
Implementing a vertically stacked structure with a thermally conductive layer, such as graphene, and a thermal-insulation interposer with cavities filled with phase change materials, along with a heat spreader, to manage heat transfer between logic and memory devices, allowing for efficient lateral heat dissipation and reduced thermal energy transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If memory devices and logic devices are arranged horizontally adjacent to each other, then heat transfer between devices is reduced, but the overall footprint of the assembly increases
Solution Approach 1:
The patent transitions from horizontal arrangement to vertical stacking of memory devices over logic devices, utilizing the third dimension (height) to reduce the two-dimensional footprint while managing heat transfer through specialized interposer structures and thermal interface materials between stacked components
2Productivity
If high-performance logic devices like GPUs are used, then processing performance increases, but heat generation increases limiting operation
Solution Approach 1:
The patent introduces an interposer structure with thermal management features, including thermally conductive materials and heat dissipation pathways, that acts as an intermediary between the high-performance logic device and memory devices, enabling heat transfer management while maintaining system performance
Solution Approach 2:
The patent modifies thermal parameters through the use of phase change materials and thermally conductive interface materials, changing the thermal conductivity and heat capacity characteristics of the assembly to better manage heat generated by high-performance logic devices
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces heat transfer between logic and memory devices, maintaining device performance while minimizing the overall footprint by directing thermal energy away from memory devices, thus enhancing the reliability and efficiency of high-performance semiconductor assemblies.
Implementation Method 1
a thermal-insulation interposer with cavities filled with phase change materials
Implementation Method 2
cavities filled with phase change materials, along with a heat spreader, to manage heat transfer between logic and memory devices
Implementation Method 3
a thermally conductive layer, such as graphene
Implementation Method 4
along with a heat spreader, to manage heat transfer between logic and memory devices
Data Source
AI summary
Semiconductor assemblies including thermal management configurations for reducing heat transfer between overlapping devices and associated systems and methods are disclosed herein. A semiconductor assembly may comprise a first device and a second device with a thermal management layer disposed between the first and second devices. The thermal management layer may be configured to reduce heat transfer between the first and second devices.