Stacked Semiconductor Image Pickup Module for Endoscope
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Solution Overview
Problem
Existing ultra-small image pickup modules for endoscopes face challenges in minimizing size and increasing reliability while maintaining effective light guidance and signal processing.
Innovation Solution
The image pickup module incorporates an image pickup device with a light receiving circuit, a prism for bending incident light, a stacked device with multiple semiconductor devices connected by solder, and a resin layer covering the bonding portions of cables and the stacked device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a compact image pickup module is used to achieve a less-invasive endoscope, then the invasiveness is reduced, but the reliability and thermal noise performance may deteriorate
Solution Approach 1:
The patent transitions from a planar wiring board layout to a three-dimensional stacked configuration. Multiple semiconductor devices are vertically stacked and bonded together, utilizing the Z-dimension (thickness direction) to accommodate more components within the same footprint. This dimensional transition enables compact module design while maintaining adequate spacing and thermal management pathways, thereby preserving reliability and reducing thermal noise in the confined space.
Solution Approach 2:
The patent implements a nested structure where multiple semiconductor devices are stacked one on top of another, with each device containing functional circuits. The stacked devices are bonded together through through-wirings that pass through multiple layers, creating a nested arrangement where smaller functional units are contained within larger structural layers. This nesting enables efficient space utilization while maintaining signal integrity and reducing thermal interference through vertical separation.
2Device complexity
If multiple semiconductor devices are stacked to integrate functions, then device complexity is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent divides the image pickup module into separate functional segments: the image pickup device, multiple stacked semiconductor devices with specific functions, and a wiring board. Each segment is manufactured and prepared independently, then assembled through controlled bonding processes. The stacked devices are separated into discrete functional units that can be precisely positioned and bonded individually, reducing the overall manufacturing precision requirements compared to creating a monolithic integrated structure.
Solution Approach 2:
The patent introduces a wiring board as an intermediary substrate that facilitates the connection between stacked semiconductor devices. The wiring board provides standardized bonding interfaces and through-wiring structures that mediate the complex interconnections between stacked devices. This intermediary layer simplifies the bonding process by providing pre-configured connection points and routing pathways, thereby reducing the precision requirements for direct device-to-device alignment.
3Productivity
If a prism is added to bend incident light, then light guidance efficiency is improved, but device complexity increases
Solution Approach 1:
The patent combines the optical guiding function with the structural support function by integrating the prism into the existing module architecture. The prism is positioned to work in conjunction with the stacked semiconductor devices, utilizing the same bonding interfaces and mounting structures. This merging of optical and structural functions allows the prism to perform light bending while the overall module structure provides support and alignment, thereby increasing light guidance efficiency without proportionally increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for a minimally invasive endoscope with enhanced reliability and reduced thermal noise, achieving efficient light guidance and signal processing within a compact form factor.
Implementation Method 1
a prism arranged on the light receiving circuit and configured to bend incident light to guide the incident light to the light receiving circuit
Implementation Method 2
a stacked device that includes a plurality of semiconductor devices each having a through wiring and bonded to each other by solder
Data Source
AI summary
An image pickup module includes an image pickup device having a light receiving circuit, a prism arranged on the light receiving circuit and configured to bend incident light to guide the incident light to the light receiving circuit, a stacked device that includes a plurality of semiconductor devices each having a through wiring and bonded to each other by solder, and is arranged around the light receiving circuit of the image pickup device, a resin layer stacked on an uppermost semiconductor device of the plurality of semiconductor devices of the stacked device, and a plurality of cables connected to the stacked device and having a connection portion with the stacked device covered with the resin layer.