Stacked Semiconductor Package Lateral Heat Dissipation Structure
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Solution Overview
Problem
Stacked semiconductor packages face challenges in effectively dissipating heat generated by high heating elements, which can lead to thermal burden on lower heating elements, potentially deteriorating their operation characteristics.
Innovation Solution
A stacked semiconductor package design incorporating a heat dissipation layer on the surface of a high heating element die, a heat insulation layer to cover the dissipation layer and the die, a heat sink on the second die, and heat conduction structures to connect the dissipation layer to the sink, allowing for lateral heat transfer and reducing thermal burden on the second die.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a stacked semiconductor package structure is used to achieve higher integration and performance, then the device density and functionality are improved, but heat dissipation becomes more difficult and thermal burden increases
Solution Approach 1:
The patent introduces a lateral heat dissipation dimension by placing heat conduction structures horizontally between the first die and heat sink, rather than relying solely on vertical heat transfer through the stacked dies. This dimensional change allows heat to escape laterally, reducing thermal burden on the second die while maintaining the stacked configuration for high integration.
Solution Approach 2:
The patent introduces intermediate heat management components including a heat dissipation layer between the first die and heat conduction structures, and a heat insulation layer between the first die and second die. These intermediary elements facilitate controlled heat transfer paths, directing heat away from the second die while maintaining electrical connectivity through the stacked structure.
2Temperature
If heat is dissipated laterally through heat conduction structures, then thermal burden on the second die is reduced, but the structural complexity of the package increases
Solution Approach 1:
The patent combines multiple functions into integrated structures: the heat conduction structures serve both as thermal management elements and as part of the structural framework supporting the stacked dies. The heat dissipation layer is integrated with the first die structure, and the heat insulation layer is incorporated into the inter-die spacing, reducing the need for separate complex components.
Solution Approach 2:
The heat conduction structures are designed to perform multiple functions: they conduct heat laterally from the first die to the heat sink, provide structural support for the stacked configuration, and maintain precise spacing between components. This multi-functionality reduces the number of separate components needed, thereby reducing overall structural complexity despite the advanced thermal management capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively dissipates heat from the high heating element without transferring it to the second die, enhancing the operation reliability of the semiconductor package by mitigating thermal stress and maintaining optimal operating conditions for both dies.
Implementation Method 1
a heat dissipation layer disposed on a surface of the first die to cover at least a portion of the first die
Implementation Method 2
a heat insulation layer disposed on the surface to cover the connection structure, the heat dissipation layer and the first die
Implementation Method 3
a heat sink disposed on the second die
Data Source
AI summary
A stacked semiconductor package includes a first die, a second die stacked on a surface of the first die, a heat dissipation layer disposed on the surface, a heat insulation layer disposed on the surface to cover the heat dissipation layer and the first die, a heat sink disposed on the second die, and a heat conduction structure spaced apart from the second die in a lateral direction on the surface to connect the heat dissipation layer to the heat sink.