Stacked Semiconductor Module Layout Without a Package Substrate
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Solution Overview
Problem
Conventional semiconductor modules with stacked memory devices face limitations in increasing capacity due to size reduction and noise sensitivity, and high manufacturing costs associated with package substrates.
Innovation Solution
A semiconductor module comprising stacked dies with a first die, a second die providing power, and a third die connected via projecting terminals and a rewiring layer, along with a heat dissipating portion, which reduces manufacturing costs by eliminating the need for a package substrate and enhances signal bandwidth and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a package substrate is used to support stacked memory devices, then the structural stability and electrical connection are improved, but the manufacturing cost increases
Solution Approach 1:
The patent extracts and eliminates the package substrate from the conventional memory module structure. The stacked memory devices are directly mounted on the circuit board without requiring a separate package substrate, thereby reducing manufacturing cost while maintaining structural stability through direct mounting and rewiring layer connections.
Solution Approach 2:
The circuit board is given multiple functions: it serves as both the mounting base for the stacked memory devices and as the electrical connection medium through rewiring layers. This eliminates the need for a dedicated package substrate, reducing component count and manufacturing cost while maintaining structural and electrical functionality.
2Quantity of substance
If the memory device size is reduced to increase capacity, then the storage capacity is improved, but the noise sensitivity increases
Solution Approach 1:
The patent transitions from planar expansion to three-dimensional stacking of memory devices. By stacking multiple memory devices vertically, the storage capacity is increased without reducing the individual device size, thereby maintaining noise performance while achieving higher capacity through vertical integration rather than horizontal expansion.
3Quantity of substance
If multiple memory devices are stacked to increase capacity, then the storage capacity is improved, but the heat dissipation becomes more difficult
Solution Approach 1:
The patent introduces heat dissipation plates as intermediary components between the stacked memory devices and the circuit board. These plates provide thermal conduction paths to efficiently dissipate heat generated by the stacked memory devices, solving the heat dissipation problem associated with vertical stacking while maintaining the high-capacity configuration.
4Area of stationary object
If the footprint is reduced by overlapping chips, then the space utilization is improved, but the signal transmission distance increases
Solution Approach 1:
The patent uses vertical stacking to reduce the horizontal footprint of the memory module. By arranging memory devices in the vertical dimension rather than spreading them out horizontally, the footprint is minimized while the signal transmission distance between adjacent stacked devices remains short, maintaining signal integrity despite the compact form factor.
Data Source
AI summary
A semiconductor module that enables reduction of manufacturing costs, a method for manufacturing the same, and a semiconductor module mounting body. The semiconductor module having a plurality of stacked dies includes: a first die; a second die disposed side by side with respect to the first die in a direction intersecting with a stacking direction; a third die disposed in the stacking direction, so as to straddle the first die and the second die and that is electrically connected to wiring surfaces of the first die and the second die opposing the third die; projection terminals projecting from the wiring surfaces of the first die and the second die and that project in a space adjacent to at least one of side surfaces of the third die in the direction intersecting with the stacking direction; and rewiring layers disposed so as to overlap with the projection terminals.