Stacked Semiconductor Output Units for Compact Power Modules
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor power modules require a large plane area due to the integration of output units and control circuits on a single planar plate, leading to space inefficiencies and potential heat management issues.
Innovation Solution
A semiconductor device design that stacks high voltage and low voltage output units, each with semiconductor elements and wirings, on top of a controller, allowing for parallel bus bars and separate heat dissipation, and includes a voltage regulator with different switching frequencies to optimize space usage and heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If power devices are arranged on one planar plate member, then integration of output units and control circuit is achieved, but plane area increases
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional stacked configuration. Output units are arranged vertically above the control circuit on the planar plate member, utilizing the vertical dimension to reduce the horizontal plane area while maintaining integration. This dimensional change allows multiple functional layers to coexist in a compact footprint.
Solution Approach 2:
The output units are nested vertically above the control circuit, with the planar plate member serving as a common substrate. The control circuit is embedded within or adjacent to the plate member, while output units are stacked above it, creating a nested hierarchical structure that maximizes space utilization.
2Area of stationary object
If output units are stacked on controller, then plane area is reduced, but heat dissipation becomes more challenging
Solution Approach 1:
The patent segments the device into distinct functional layers: the control circuit layer on the planar plate member and the output unit layers stacked above. This segmentation allows independent thermal management strategies for each layer, with heat dissipation paths optimized for their respective positions and functions.
Solution Approach 2:
The planar plate member serves as an intermediary thermal management component between the control circuit and the stacked output units. It provides a thermally conductive pathway that distributes and dissipates heat from multiple sources, preventing heat concentration while maintaining the compact stacked structure.
3Area of stationary object
If high voltage and low voltage units are stacked with parallel bus bars, then space efficiency is improved, but current density increases
Solution Approach 1:
The patent arranges high voltage and low voltage units in vertical stacks with parallel bus bars extending in the horizontal dimension. This spatial separation in the vertical dimension while maintaining parallel horizontal pathways allows current to distribute across multiple pathways, reducing current density despite the compact footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly reduces the plane area required for the semiconductor device while improving heat dissipation and air permeability, extending the lifespan of the device by preventing heat concentration and facilitating efficient cooling.
Implementation Method 1
each of the first and second output units further includes a radiator plate for conducting heat in a direction different from a direction in which the controller is disposed
Data Source
AI summary
A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.