Stacked Semiconductor Package Layout for Smaller, Reliable Assembly
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor packages face issues of excess cost, decreased reliability, and large package sizes, leading to inadequate performance.
Innovation Solution
The integration of package-on-package configurations with device stacking on a single substrate, utilizing conductive structures and encapsulants to form semiconductor devices that include substrate interconnects and electronic components, providing protection and electrical coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional semiconductor packages are used, then manufacturing is simpler, but package size is too large and reliability is decreased
Solution Approach 1:
The patent implements package-on-package configuration where a first package is placed on top of a second package, with each package containing electronic components and encapsulants. This nesting approach vertically stacks packages to reduce overall footprint while maintaining individual package functionality and reliability
Solution Approach 2:
The patent transitions from horizontal package arrangement to vertical stacking by utilizing the Z-dimension (height). Multiple packages are stacked vertically on a single substrate, converting a 2D layout problem into a 3D structure to reduce package size while improving reliability through enhanced protection
2Ease of manufacture
If conventional semiconductor packages are used, then manufacturing process is simpler, but cost is excessive
Solution Approach 1:
The patent merges multiple packages onto a single substrate, sharing common structural elements such as the substrate itself and encapsulants. This consolidation reduces total material consumption while maintaining manufacturing simplicity through integrated construction processes
Solution Approach 2:
The substrate serves multiple functions by supporting both the first and second packages, acting as a common foundation that reduces overall material requirements. The encapsulants similarly provide universal protection across multiple components, optimizing material usage
3Productivity
If package-on-package configuration with device stacking is implemented, then integration level increases and package size reduces, but manufacturing complexity increases
Solution Approach 1:
The patent divides the semiconductor system into distinct modular packages (first package, second package) that can be manufactured and positioned separately. Each package is a self-contained unit with its own electronic components and encapsulant, allowing independent fabrication and assembly to manage complexity
Data Source
AI summary
In one example, a semiconductor device includes a substrate with a top side, a bottom side, and a conductive structure. A first electronic component includes a first side, a second side, and first component terminals adjacent to the first side. The first component terminals face the substrate bottom side and are connected to the conductive structure. A second electronic component comprises a first side, a second side, and second component terminals adjacent to the second electronic component first side. The second electronic component second side is connected to the first electronic component second side with a coupling structure so that the first component terminals and the second component terminals face opposite directions. Interconnects are connected to the conductive structure. The second component terminals and the interconnects are configured for connecting to a next level assembly. Other examples and related methods are also disclosed herein.