Stacked Semiconductor Package Module with Heat Radiating Plate
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Solution Overview
Problem
Current semiconductor package modules face challenges in maximizing storage capacity and data processing speed while minimizing volume, with heat dissipation issues affecting performance.
Innovation Solution
A semiconductor package module design featuring a circuit board with a concave receiving portion, conductive patterns, and a connection member including an insulation member and conductive pathways, along with a heat radiating plate and fins for efficient heat dissipation, allowing for the stacking of multiple semiconductor packages without increasing thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple semiconductor packages are stacked to increase storage capacity and data processing speed, then the storing capacity and processing speed are improved, but the heat dissipation becomes more difficult and volume management becomes challenging
Solution Approach 1:
The patent implements multi-layer stacking of semiconductor packages where packages are nested vertically within the circuit board. Multiple semiconductor packages are positioned at different heights (first level, second level, third level) and electrically connected through conductive patterns extending through the board, enabling high-density integration without significantly increasing horizontal footprint.
Solution Approach 2:
The patent introduces a heat radiating plate as an intermediary component between the semiconductor packages and the external environment. The plate is positioned to receive heat from multiple semiconductor packages and transfers it outward through its extended surface area, effectively managing thermal loads from densely stacked packages.
2Volume of stationary object
If multiple semiconductor packages are stacked vertically, then the volume is reduced, but the heat dissipation path becomes more complex
Solution Approach 1:
The patent implements multi-layer stacking of semiconductor packages where packages are nested vertically within the circuit board. Multiple semiconductor packages are positioned at different heights (first level, second level, third level) and electrically connected through conductive patterns extending through the board, enabling high-density integration without significantly increasing horizontal footprint.
Solution Approach 2:
The heat radiating plate serves multiple functions simultaneously: it acts as a thermal management component for multiple semiconductor packages, provides structural support for the stacked packages, and extends the surface area for heat dissipation. This multi-functional design simplifies the overall heat dissipation structure while managing complex thermal loads.
3Quantity of substance
If semiconductor packages are densely packed to increase storage capacity, then the storing capacity is improved, but the electrical connection complexity increases
Solution Approach 1:
The patent implements multi-layer stacking of semiconductor packages where packages are nested vertically within the circuit board. Multiple semiconductor packages are positioned at different heights (first level, second level, third level) and electrically connected through conductive patterns extending through the board, enabling high-density integration without significantly increasing horizontal footprint.
Solution Approach 2:
The patent transitions from horizontal to vertical arrangement of semiconductor packages. By stacking packages in the vertical dimension (z-axis) rather than arranging them horizontally (x-y plane), the design achieves higher storage capacity within the same footprint. Conductive patterns are extended through the board thickness to establish electrical connections between vertically stacked packages.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances storage capacity and data processing speed while effectively managing heat dissipation, thereby improving the overall performance and efficiency of the semiconductor package module.
Implementation Method 1
the board body includes a heat radiating plate located within the board body which facilitates the dissipation of heat generated by the semiconductor package to the outside
Implementation Method 2
the projected portion of the heat radiating plate includes a plurality of heat dissipation fins
Implementation Method 3
the projected portion of the heat radiating plate includes a plurality of heat dissipation fins
Implementation Method 4
The conductive pattern and the first connection pattern and the conductive pattern and the second connection pattern are electrically connected by a solder or an anisotropic conductive film (ACF)
Data Source
AI summary
A semiconductor package module includes a circuit board including a board body having a receiving portion and conductive patterns formed on the board body; a semiconductor package received in the receiving portion and having conductive terminals electrically connected to the conductive patterns and an s semiconductor chip electrically connected to the conductive terminals; and a connection member electrically connecting the conductive patterns and the conductive terminals. In the present invention, after a receiving portion having a receiving space is formed in the board body of a circuit board and a semiconductor package is received in the receiving portion, and a connection terminal of the semiconductor package and a conductive pattern of the board body are electrically connected using a connection member, a plurality of semiconductor packages can be stacked in a single circuit board without increasing the thickness thereby significantly improving data storage capacity and data processing speed of the semiconductor package module.