Stacked Semiconductor Package for Power Converter Efficiency
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Solution Overview
Problem
In power converter circuits, there is a need to minimize space on printed circuit boards while reducing switching losses and parasitic inductances by integrating semiconductor devices with short interconnections, which existing technologies have not effectively addressed.
Innovation Solution
A semiconductor package is fabricated with a first semiconductor module containing transistor chips and diode chips embedded in a encapsulation layer, and a second module with driver chips and passive components, where the modules are connected via metallic pins and sleeves, and encapsulated with thermally conductive filler materials to reduce interconnections and enhance thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If semiconductor devices are mounted as individual components on a printed circuit board, then ease of manufacture and assembly is improved, but space consumption increases and interconnection lengths become longer leading to higher switching losses and parasitic inductances
Solution Approach 1:
The patent combines multiple semiconductor devices (transistor chips, diode chips, driver chips) and passive components into a single integrated semiconductor package with a common encapsulation body. This merging eliminates the need for separate PCB mounting of individual components, thereby reducing overall space consumption while maintaining manufacturability through modular assembly processes.
Solution Approach 2:
The patent transitions from a two-dimensional PCB layout to a three-dimensional integrated package structure. By stacking components vertically within a common encapsulation body and using multi-layer carrier boards, the design utilizes the third dimension to reduce footprint area while keeping assembly processes manageable.
2Ease of manufacture
If individual components are mounted on a printed circuit board, then ease of manufacture is improved, but interconnection lengths increase causing higher switching losses and parasitic inductances
Solution Approach 1:
By integrating transistor chips, diode chips, and driver chips into a single semiconductor package with short internal interconnections, the patent minimizes the distance current must travel during switching operations. This dramatically reduces parasitic inductances and switching losses compared to separate PCB-mounted components with long trace lengths.
3Loss of energy
If semiconductor devices are integrated with short interconnections, then switching losses and parasitic inductances are reduced, but device complexity increases
Solution Approach 1:
The patent divides the semiconductor package into distinct functional modules: a first carrier board containing transistor and diode chips, a second carrier board containing driver chips and passive components, and an encapsulation body. This segmentation allows complex functionality to be achieved while maintaining manageable assembly processes and facilitating modular manufacturing.
4Volume of moving object
If components are integrated into a compact package, then space consumption is reduced, but thermal management becomes more challenging
Solution Approach 1:
The patent introduces a thermally conductive filler material as an intermediary between the semiconductor chips and the external environment. This filler material fills the encapsulation body and provides efficient thermal pathways from the heat-generating chips to the package exterior, enabling effective heat dissipation in the compact integrated structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces switching losses and parasitic inductances, allowing for more compact and efficient power converter circuits with improved thermal management and reduced interconnection lengths.
Implementation Method 1
encapsulated with thermally conductive filler materials to reduce interconnections and enhance thermal conductivity
Data Source
AI summary
A semiconductor package includes a first semiconductor module including a plurality of semiconductor transistor chips and a first encapsulation layer disposed above the semiconductor transistor chips, and a second semiconductor module disposed above the first semiconductor module. The second semiconductor module includes a plurality of semiconductor driver channels and a second encapsulation layer disposed above the semiconductor driver channels. The semiconductor driver channels are configured to drive the semiconductor transistor chips.