Stacked Semiconductor Packages Using Lead Frame Connectors
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional stacked semiconductor packages require significant additional structure for stackability, increasing processing steps, time, and expense, and are limited in the number of die that can be stacked due to thickness constraints, leading to potential die damage and reduced yields.
Innovation Solution
The use of internal or external connectors, formed from conventional lead frames, to electrically couple stacked semiconductor packages, allowing for batch processing and singulation of IC assemblies to form stacked semiconductor package assemblies, which can be joined to increase storage capacity without the need for extensive additional structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional stacked semiconductor packages use significant additional structure for stackability, then the packages can be stacked, but processing steps, time, and expense increase
Solution Approach 1:
The patent extracts the essential function of stackability from complex support structures and reduces it to basic connector elements. The connectors are simplified to minimal structures that provide only the necessary electrical coupling function, removing unnecessary structural complexity while maintaining stackability.
Solution Approach 2:
Instead of adding complex structures to enable stacking, the patent inverts the approach by using simplified connectors that naturally enable stacking through their basic electrical coupling function. The stacking capability emerges from the simple connector design rather than being imposed by complex additional structures.
2Quantity of substance
If more die are stacked within a package, then storage capacity increases, but the likelihood of die damage and reduced yields increases
Solution Approach 1:
The patent segments the package into modular units with individual connectors for each die. This segmentation allows each die to be independently supported and connected, reducing the risk that stacking issues will affect multiple dies simultaneously. The modular connector design isolates potential damage to individual connection points.
Solution Approach 2:
The connectors serve as intermediary elements between dies, providing a buffer that protects dies from direct mechanical contact and potential damage during stacking. The connectors mediate the mechanical and electrical interface, absorbing stresses and preventing die-to-die damage while enabling high-density stacking.
3Reliability
If significant additional structure is used for stackability, then packages can be stacked, but processing time and costs increase
Solution Approach 1:
The connectors are pre-formed and pre-attached to dies before the stacking process. This preliminary action allows dies to be stacked directly without requiring complex assembly procedures during the stacking operation, significantly reducing processing time while maintaining reliable electrical connections.
Solution Approach 2:
The simple connector design allows packages to be stacked using basic assembly processes that do not require specialized equipment or complex procedures. The connectors are self-aligning and self-supporting, enabling automated stacking processes to operate efficiently without additional processing steps.
Data Source
AI summary
An electronic component is disclosed including a plurality of stacked semiconductor packages. A first such embodiment includes an internal connector for electrically coupling the stacked semiconductor packages. A second such embodiment includes an external connector for electrically coupling the stacked semiconductor packages.