Stacked Semiconductor Packages With Embedded Connectors
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Solution Overview
Problem
Conventional stacked semiconductor packages face limitations in increasing storage capacity due to thickness constraints, high die damage during assembly, and increased complexity and cost associated with additional stacking structures, which hinder the efficient integration of multiple memory dies within a package.
Innovation Solution
The implementation of internal and external electrical connectors formed from conventional lead frames, such as copper alloy, to electrically couple stacked semiconductor packages, allowing for the formation of internal lead stacked semiconductor package assemblies and external connector stacked semiconductor package assemblies, which can be batch processed and singulated to form efficient and reliable electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional stacked semiconductor packages are used to increase storage capacity, then more memory die can be integrated, but the package thickness increases beyond standard slot limits
Solution Approach 1:
The patent embeds electrical connectors within the mold compound of semiconductor packages, nesting the connection structure inside the package body rather than extending externally. This allows multiple packages to be stacked vertically with connectors hidden inside, increasing storage capacity while maintaining a thin overall profile that fits standard slots.
Solution Approach 2:
The patent transitions from planar packaging to three-dimensional stacked packaging by extending electrical connectors vertically between packages. This dimensional change allows multiple memory die to be integrated in the vertical direction, dramatically increasing storage capacity without increasing the horizontal footprint or exceeding slot thickness limits.
2Quantity of substance
If additional stacking structures are added to increase storage capacity, then more memory die can be integrated, but fabrication complexity and cost increase
Solution Approach 1:
The patent merges the electrical connector structure with the mold compound by embedding connectors within the encapsulation material during the molding process. This consolidation eliminates the need for separate connector assembly steps and reduces the number of discrete components, thereby simplifying fabrication and reducing cost while enabling multi-die stacking.
Solution Approach 2:
The mold compound serves multiple functions: it provides mechanical protection for the die, acts as an insulating material, and serves as the embedding medium for electrical connectors. This multi-functionality reduces the need for additional specialized structures or materials, simplifying the overall device architecture and fabrication process.
3Quantity of substance
If additional stacking structures are added to increase storage capacity, then more memory die can be integrated, but manufacturing cost increases
Solution Approach 1:
The patent combines the electrical connector fabrication with the mold compound injection process, allowing connectors to be embedded during the standard packaging operation. This integration eliminates separate manufacturing steps for connector installation, reducing labor and equipment costs while enabling cost-effective production of high-capacity stacked packages.
Solution Approach 2:
The mold compound injection process automatically positions and secures the electrical connectors within the package structure during encapsulation. This self-positioning capability eliminates the need for precise manual alignment or additional fixation steps, reducing manufacturing complexity and cost while maintaining connector reliability.
4Quantity of substance
If more memory die are stacked within a package, then storage capacity increases, but die damage during assembly increases
Solution Approach 1:
The mold compound provides a cushioning matrix that surrounds and protects each memory die during the stacking and assembly process. This protective encapsulation prevents mechanical damage from handling and assembly operations, enabling higher die counts to be stacked reliably without increasing damage risk.
Solution Approach 2:
By nesting connectors within the mold compound and embedding die securely in the encapsulation material, the patent creates a protected hierarchical structure. This nested configuration shields vulnerable die and connection points from external mechanical stresses, maintaining die integrity even as the number of stacked die increases.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of high-capacity electronic components by efficiently coupling semiconductor packages, reducing die damage and fabrication complexity, while maintaining reliability and cost-effectiveness, thereby addressing the limitations of conventional packaging methods.
Implementation Method 1
internal connectors for electrically coupling the stacked semiconductor packages
Data Source
AI summary
An electronic component is disclosed including a plurality of stacked semiconductor packages. A first such embodiment includes an internal connector for electrically coupling the stacked semiconductor packages. A second such embodiment includes an external connector for electrically coupling the stacked semiconductor packages.