Stacked Semiconductor Device Repair via Differential Hardness Bumps
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Solution Overview
Problem
In stacked semiconductor devices, it is challenging to selectively remove defective onboard-components from a large-size mother-plate and replace them with functional ones due to the difficulty in easily peeling off defective components and connecting new ones, leading to poor manufacturing efficiency and waste of operational components.
Innovation Solution
The use of parent and repair bumps with different hardness levels, where the repair bumps have a higher hardness intermediate layer that penetrates and bonds with the parent bumps at intersections, allowing for selective removal and replacement of defective onboard-components through solid-phase diffusion bonding, even at low temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of repair
If conventional bonding methods are used to mount onboard-components on the mother-plate, then the stacked semiconductor device can be assembled, but defective onboard-components cannot be selectively removed and replaced, leading to waste of operational components and poor manufacturing efficiency
Solution Approach 1:
The bonding structure is segmented into two distinct parts: a soft parent bump on the mother-plate and a hard repair bump on the onboard-component. This segmentation allows differential mechanical properties at different locations, enabling selective removal of defective components while preserving the mother-plate and other operational components.
Solution Approach 2:
Different hardness properties are applied locally to different parts of the bonding structure. The parent bump on the mother-plate is made soft to prevent damage during repair operations, while the repair bump on the onboard-component is made hard to enable easy removal when defective. This local differentiation of material properties solves the contradiction between ease of repair and manufacturing efficiency.
2Ease of operation
If uniform hardness bumps are used for bonding, then the bonding structure is simple, but defective components cannot be easily peeled off without deforming the entire structure
Solution Approach 1:
The bump structure employs local quality by assigning different hardness properties to different components: the parent bump on the mother-plate is soft while the repair bump on the onboard-component is hard. This localized differentiation enables easy peeling of defective components without deforming the entire structure, while maintaining relatively simple overall structure.
Solution Approach 2:
The bonding structure is made asymmetric in terms of material properties: the parent bump and repair bump have different hardness characteristics. This asymmetry allows the repair bump to be easily removed from the soft parent bump when defective, while the soft parent bump remains intact on the mother-plate for potential reuse.
3Ease of repair
If multiple repair processes are performed, then defective components can be replaced, but the entire structure deforms due to repeated heating and cooling
Solution Approach 1:
The differential hardness design allows the hard repair bump to be easily removed from the soft parent bump through simple mechanical peeling without requiring high-temperature heating. This eliminates repeated thermal cycles that would cause structural deformation, enabling multiple repair processes while maintaining structural stability.
Solution Approach 2:
The conventional thermal bonding process is replaced with a mechanical peeling process. Instead of using heat to separate bonded components, the hard repair bump is simply peeled off from the soft parent bump through mechanical force. This substitution eliminates thermal effects that cause structural deformation during repair operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables efficient repair processing by allowing for the selective removal and replacement of defective components, reducing waste and improving manufacturing efficiency by increasing the number of allowable repair processes without deforming the entire structure.
Implementation Method 1
a repair bump provided on the onboard-element at a side of the connection face, having a repair-site wall made of a layer of conductor having different hardness from the mother-site wall, the repair-site wall is perpendicular to the connection face, configure to bite each other with the parent bump at an intersection between the mother-site wall and the repair-site wall conductor
Data Source
AI summary
A stacked semiconductor device encompasses a mother-plate having a mounting-main surface and a bottom-main surface, an onboard-element having a connection face facing to the mounting-main surface, a parent bump provided on the mother-plate, having a mother-site wall made of a layer of conductor, mother-site wall is perpendicular to the mounting-main surface, and a repair bump provided on the onboard-element at a side of the connection face, having a repair-site wall made of a layer of conductor having different hardness from the mother-site wall, the repair-site wall is perpendicular to the connection face, configure to bite each other with the parent bump at an intersection between the mother-site wall and the repair-site wall conductor.