Stacked Semiconductor Resin Layout for Precise Chip Alignment
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Solution Overview
Problem
Existing semiconductor devices face challenges in maintaining reliable electrical connections and improving electrical characteristics due to the interference of resin bodies during stacking processes.
Innovation Solution
The semiconductor device design includes a resin body positioned closer to the wiring layer than the interface between stacked chips, allowing for unhindered stacking and improved electrical connections by strategically removing a portion of the resin body to facilitate precise alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a resin body is used to cover the periphery of stacked chips, then structural support and protection are improved, but the resin body interferes with the stacking process and deteriorates alignment precision
Solution Approach 1:
The resin body is divided into two distinct parts: a first resin body that covers the periphery of the first stacked body and provides structural support, and a second resin body that fills the groove formed by removing part of the first resin body. This segmentation allows each resin body to serve its specific function without interfering with the stacking process, as the first resin body's peripheral coverage maintains stability while the grooved structure enables precise alignment during bonding.
Solution Approach 2:
The first resin body has non-uniform thickness with a specific groove structure created by removing part of it, creating different local properties: the thicker peripheral regions provide structural support and protection, while the thinner grooved region facilitates precise alignment and bonding between stacked chips. This local quality variation resolves the contradiction by providing both structural integrity and manufacturing precision in different locations of the same component.
2Reliability
If the resin body is positioned closer to the wiring layer, then electrical connection reliability is improved, but the resin body volume increases and complicates the stacking process
Solution Approach 1:
The resin body is segmented into a first resin body covering the periphery and a second resin body filling the groove, with the second resin body positioned closer to the wiring layer. This segmentation allows the critical electrical connection region to have enhanced reliability through the second resin body's proximity to the wiring layer, while the first resin body's peripheral structure maintains overall stability without excessive volume increase.
Solution Approach 2:
The groove structure in the first resin body creates a vertical dimension solution by removing material to form a recess that is then filled by the second resin body. This dimensional approach allows the second resin body to be positioned closer to the wiring layer (improving electrical connection reliability) while the overall resin volume is controlled by the grooved structure, preventing excessive complexity in the stacking process.
Data Source
AI summary
A semiconductor device includes a wiring layer; a first stacked body disposed on the wiring layer; a second stacked body disposed on the first stacked body in a stacking direction; and a first resin body disposed around a periphery of the first stacked body. The first stacked body includes a first pad electrically connected to the wiring layer, a first device layer electrically connected to the first pad, and a first electrode electrically connected to the first device layer. The second stacked body includes a second pad electrically connected to the first electrode and a second device layer electrically connected to the second pad. In the stacking direction, the first resin body is vertically located closer to the wiring layer than an interface between the first stacked body and the second stacked body.