Stacked Semiconductor Shield Layer for Noise and Heat Isolation
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Solution Overview
Problem
In stacked structures of plural substrates, noise and heat such as electromagnetic waves, infrared rays, or surges are propagated between elements, leading to deterioration of element characteristics.
Innovation Solution
The semiconductor apparatus includes a first substrate with a first element layer, a first wiring layer, and a shield layer, and a second substrate with a second element layer and a second wiring layer, stacked together with an electromagnetic shield layer or a light attenuation/reflection preventing section to mitigate noise and heat propagation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If plural substrates are stacked to increase element density, then the number of elements increases, but noise and heat propagate between substrates causing element characteristic deterioration
Solution Approach 1:
An electromagnetic shield layer is inserted between the first substrate and second substrate to block electromagnetic waves, infrared rays, and surges from propagating between the substrates. This intermediary layer prevents noise and heat transmission while allowing the stacked configuration to maintain high element density, thus resolving the contradiction between increasing element quantity and maintaining element characteristic reliability.
2Area of stationary object
If substrates are stacked closely to reduce area size, then area efficiency increases, but electromagnetic interference and heat propagation worsen
Solution Approach 1:
The electromagnetic shield layer serves as a mediator that enables close substrate stacking for area efficiency while simultaneously blocking electromagnetic interference and heat propagation. The shield layer includes electrically conductive material that reflects or absorbs electromagnetic waves, preventing harmful factors from affecting elements on adjacent substrates despite the reduced spacing between substrates.
3Device complexity
If no shield layer is used to simplify structure, then device complexity decreases, but noise and heat propagation causes element deterioration
Solution Approach 1:
The electromagnetic shield layer is configured as a relatively simple structure comprising an electrically conductive layer formed on the wiring layer, combined with conductive plugs and conductive films that are standard components in semiconductor manufacturing. This intermediary structure effectively blocks noise and heat propagation between substrates without introducing excessive complexity, as the shield layer can be integrated into the existing multi-layer wiring structure using conventional fabrication processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses noise and heat propagation between stacked substrates, preserving the characteristics of the elements and enhancing the performance of the semiconductor apparatus.
Implementation Method 1
a shield layer including an electrically conductive material arranged on the first wiring layer... effectively suppresses noise and heat propagation between stacked substrates
Implementation Method 2
a light attenuation section including a material whose refractive index is higher than a refractive index of surrounding materials... suppresses propagation of noise and heat
Data Source
AI summary
A semiconductor apparatus that makes it possible to suppress propagation of noise and heat between elements formed in upper and lower substrates in a stacked structure of plural substrates and suppress deterioration of characteristics of the elements is provided. The semiconductor apparatus includes: a first substrate including a first element layer including a first active element, a first wiring layer arranged on the first element layer, and a shield layer including an electrically conductive material arranged on the first wiring layer; and a second substrate including a second element layer including a second active element arranged on the shield layer, and a second wiring layer arranged on the second element layer, in which the first substrate and the second substrate are stacked one on another.