Stacked Semiconductor Package Shielding Unit
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Solution Overview
Problem
The stacked semiconductor package structure is prone to electromagnetic interference (EMI) due to the close proximity of semiconductor chips, which can lead to malfunctions, especially when sensitive RF chips are packaged with semiconductor memory chips having high switching noise.
Innovation Solution
Incorporating a shielding unit with a conductor maintained at a predetermined voltage between the semiconductor chips, either through a wire board or interposer chips, to shield electromagnetic waves and prevent defects in wire bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor chips are stacked vertically in close proximity, then the miniaturization and integration density are improved, but electromagnetic interference between chips increases causing malfunctions
Solution Approach 1:
A shielding unit is introduced as an intermediary component between adjacent semiconductor chips. This shielding unit, positioned in the space between chips, blocks electromagnetic waves generated by one chip from reaching adjacent chips, thereby preventing electromagnetic interference while maintaining the vertical stacked configuration for high integration density
Solution Approach 2:
The harmful electromagnetic field is extracted or removed from the space between chips by introducing the shielding unit. The shielding unit absorbs or redirects electromagnetic waves, effectively taking out the harmful factor from the chip environment while preserving the compact stacked structure
2Volume of moving object
If semiconductor chips are packaged together in a stacked structure, then the package size is reduced, but noise from high-switching chips affects sensitive RF chips
Solution Approach 1:
The shielding unit acts as a mediator that separates noise-generating chips from noise-sensitive RF chips within the compact package. By positioning the shielding unit between these chips, switching noise is blocked from reaching sensitive components, allowing high-density packaging without compromising signal integrity
Solution Approach 2:
Different regions of the package are differentiated by introducing the shielding unit specifically in areas where electromagnetic interference is most problematic. The shielding unit is strategically positioned between high-noise and sensitive chips, creating local protection zones while maintaining overall package compactness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively reduces electromagnetic interference, preventing malfunctions in internal circuits and avoiding defects in wire bonding, thereby enhancing the performance and reliability of the semiconductor package.
Implementation Method 1
at least one shielding unit configured to be formed between the plurality of semiconductor chips and to be maintained at a predetermined voltage
Implementation Method 2
the conductor is maintained at a predetermined voltage through a via-hole
Data Source
AI summary
A semiconductor package includes a wire board, a plurality of semiconductor chips configured to be stacked over the wire board and to be electrically coupled with the wire board, and at least one shielding unit configured to be formed between the plurality of semiconductor chips and to be maintained at a predetermined voltage.