Stacked Single-Crystal Semiconductor Substrates for High-Resolution Micro-Displays

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Solution Overview

Problem

Current display devices for head-mounted display devices require high-resolution images, but existing fabrication methods are costly and have low yield due to the need for uniform semiconductor processes across different substrate sizes.

Innovation Solution

A micro-display device using two different single crystal semiconductor substrates, where the smaller substrate allows for higher yield and cost reduction by optimizing semiconductor processes, and the larger substrate enables high-resolution display with minimized unnecessary areas.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If uniform semiconductor processes are applied across different substrate sizes, then manufacturing consistency is maintained, but fabricating cost increases and yield decreases

Engineering Contradiction:
Improvemanufacturing consistencyVSAvoidfabricating yield
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent divides the semiconductor manufacturing process into separate stages for different substrate sizes. Small substrates (e.g., 2-inch) are processed independently from large substrates (e.g., 6-inch), allowing each to be optimized for its specific requirements. This segmentation enables high-yield mass production on small substrates while maintaining the capability for high-resolution displays on large substrates, thereby resolving the contradiction between manufacturing consistency and fabricating yield.

Inventive Principle:
Principle #1Segmentation

2Productivity

If small substrate size is used, then fabricating yield improves and cost reduces, but display resolution capability is limited

Engineering Contradiction:
Improvefabricating yieldVSAvoiddisplay resolution
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent transitions from a single-substrate approach to a multi-substrate stacked architecture. Small substrates are bonded to large substrates in a vertical configuration, allowing the system to achieve high resolution through the large substrate's area while maintaining high yield through the small substrate's efficient manufacturing. This dimensional transition from 2D planar to 3D stacked architecture resolves the contradiction between yield and resolution.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Manufacturing precision

If large substrate area is used, then high-resolution display is achieved, but unnecessary regions increase and cost rises

Engineering Contradiction:
Improvedisplay resolutionVSAvoidunnecessary areas
Core Design Contradiction:
Manufacturing precisionVSLoss of substance

Solution Approach 1:

The patent segments the functional areas of the display device by placing small active substrates containing only necessary pixel regions onto a larger carrier substrate. This segmentation allows the active display area to be maximized while minimizing wasted space on the carrier, as the small substrates can be densely packed and precisely positioned, reducing the proportion of unnecessary regions.

Inventive Principle:
Principle #1Segmentation

4Productivity

If different substrate sizes are processed together, then manufacturing efficiency improves, but process optimization for specific device sizes is compromised

Engineering Contradiction:
Improvemanufacturing efficiencyVSAvoidprocess optimization
Core Design Contradiction:
ProductivityVSEase of manufacture

Solution Approach 1:

The patent implements segmentation by processing small substrates and large substrates in separate manufacturing lines, each optimized for its specific substrate size. Small substrate lines are optimized for high-volume, cost-effective production, while large substrate lines are optimized for high-resolution precision manufacturing. This segmented approach maintains manufacturing efficiency through specialized processes while enabling full process optimization for each substrate type.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS20250048858A1Display device, method of fabricating the same and head mounted display device including the same
Publication Date: 2025.02.06 SAMSUNG DISPLAY CO LTD
  • US20250048858A1 patent drawing
  • US20250048858A1 patent drawing
  • US20250048858A1 patent drawing

AI summary

A display device is disclosed that includes a first single crystal semiconductor substrate comprising a plurality of first transistors, a second single crystal semiconductor substrate disposed on the first single crystal semiconductor substrate and comprising a plurality of second transistors, a light emitting element layer disposed on the second single crystal semiconductor substrate and comprising a plurality of light emitting elements. In a plan view, an area of the first single crystal semiconductor substrate is smaller than an area of the second single crystal semiconductor substrate. A minimum line width of one of the first transistors is smaller than a minimum line width of one of the second transistors.