Stacked Semiconductor Device Electroconductive Support Member
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Solution Overview
Problem
Conventional semiconductor devices with multiple stacked elements face limitations in electrical connectivity due to material and thickness constraints of wires, leading to reduced current flow and interference between elements.
Innovation Solution
A semiconductor device design featuring a first semiconductor element, a second semiconductor element, an electroconductive support member, and a resin package, where the second element is positioned between the first element and the support member, with wires and electroconductive bonding materials providing electrical connections that enhance current flow without increasing device size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wires are used to electrically connect the first semiconductor element and the second semiconductor element, then electrical connection is achieved, but the current flow is limited due to material and thickness constraints of the wires
Solution Approach 1:
The patent introduces an electroconductive support member as an intermediary between the first and second semiconductor elements. This support member includes electroconductive elements that provide a low-resistance path for current flow, replacing the limited wire-based connection while maintaining reliable electrical connectivity between the stacked elements.
Solution Approach 2:
The electroconductive support member serves multiple functions: it provides electrical connection between semiconductor elements, supports the mechanical structure of the stacked configuration, and enables higher current flow capacity. This multi-functional component resolves the contradiction by simultaneously achieving reliable connection and enhanced power capability.
2Volume of moving object
If the first semiconductor element and the second semiconductor element are arranged close to each other to reduce device size, then device dimensions are reduced, but the functions of the two elements interfere with each other
Solution Approach 1:
The electroconductive support member acts as a mediator that enables close spacing of the semiconductor elements while preventing functional interference. By providing dedicated electroconductive pathways and mechanical support, it allows the elements to be positioned closer together without compromising their individual functional performance.
Solution Approach 2:
The patent transitions from a planar arrangement to a three-dimensional stacked configuration, utilizing the vertical dimension to reduce the device footprint. The electroconductive support member enables this vertical stacking by providing proper electrical and mechanical connections, allowing elements to be arranged in the thickness direction rather than requiring lateral expansion.
3Reliability
If wires are used to connect the semiconductor elements, then electrical connection is achieved, but the arrangement of wires becomes complicated
Solution Approach 1:
The electroconductive support member serves as an intermediary structure that consolidates multiple connection points into a single integrated component. Instead of requiring multiple individual wires to connect various electrodes between stacked elements, the support member provides a structured array of electroconductive elements that simplify the connection architecture and reduce wiring complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures proper electrical connection between semiconductor elements, allowing for increased current flow while reducing device size and preventing functional interference between elements.
Implementation Method 1
an electroconductive bonding material that bonds the second electrode of the second semiconductor element and the electroconductive element to which the wire is bonded
Data Source
AI summary
A semiconductor device includes first and semiconductor elements, an electroconductive support member including electroconductive elements, and a resin package. The first semiconductor element includes a first active surface and first electrodes formed on the first active surface. The second semiconductor element includes a second active surface and second electrodes formed on the second active surface. The electroconductive support member is electrically connected to the first and second semiconductor elements and support these elements. The resin package covers the first and second semiconductor elements. The second semiconductor element is located between the first semiconductor element and the electroconductive support member. The first electrodes of the first semiconductor element and the electroconductive elements are connected by wire. An electroconductive bonding material is also provided that bonds the second electrodes of the second semiconductor element and the electroconductive elements to which the wire is bonded.