Stacked Semiconductor Assembly With Thermal Isolation During Die Curing

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Solution Overview

Problem

Thermal energy applied to cure a first semiconductor die package adversely affects adjacent packages, leading to improper deformation or adhesion of curable layers in stacked semiconductor devices.

Innovation Solution

Employing a temperature adjusting component, such as a cooling unit or heat sink, to thermally isolate and manage thermal energy, preventing excessive heat transfer to adjacent semiconductor devices during thermal bonding processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If thermal energy is applied to cure a first semiconductor die package, then the curable layers in the first package are properly cured and bonded, but the thermal energy adversely affects adjacent semiconductor die packages causing improper deformation or adhesion of their curable layers

Engineering Contradiction:

Improvecuring quality of curable layersVSAvoidthermal impact on adjacent packages

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

A temperature adjusting component is introduced as an intermediary between the thermal bonding process and adjacent semiconductor die packages. This component selectively manages thermal energy transfer, allowing sufficient heat to reach the first package for proper curing while blocking excessive heat from reaching adjacent packages, thereby preventing thermal damage without compromising bonding quality

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The temperature adjusting component creates localized thermal zones, allowing different regions of the semiconductor device assembly to experience different temperature conditions. The area near the first package receives controlled thermal energy for curing, while adjacent areas are protected from excessive heat, enabling simultaneous processing with differentiated thermal requirements

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Maintains the temperature of adjacent semiconductor devices within a desired range, ensuring proper curing of curable layers and effective adhesion between stacked semiconductor devices.

Implementation Method 1

absorbing a portion of the thermal energy generated during thermal bonding processing

Methodology Applied

Scientific EffectThermal energy absorption: Absorption (EM radiation)

Implementation Method 2

thermally isolate and manage thermal energy

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20260096489A1Mitigating thermal impacts on adjacent stacked semiconductor devices

Publication Date: 2026.04.02 LODESTAR LICENSING GROUP LLC

AI summary

A semiconductor device assembly and associated methods are disclosed herein. The semiconductor device assembly includes (1) a substrate having a first side and a second side opposite the first side; (2) a first set of stacked semiconductor devices at the first side of the substrate; (3) a second set of stacked semiconductor devices adjacent to one side of the first set of stacked semiconductor devices; (4) a third set of stacked semiconductor devices adjacent to an opposite side of the first set of stacked semiconductor devices; and (5) a temperature adjusting component at the second side and aligned with the second set of stacked semiconductor devices. The temperature adjusting component is positioned to absorb the thermal energy and thereby thermally isolate the second set of stacked semiconductor devices from the first set of stacked semiconductor devices.