Stacked Semiconductor Device Through Electrode Bonding
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Solution Overview
Problem
Conventional electronic devices face challenges with increased size in thickness due to the need for larger internal connection terminals and reliability issues with solder balls in electrical connections between semiconductor devices.
Innovation Solution
The electronic device design incorporates a first semiconductor device with a multilayer interconnection structure and a second semiconductor device, where through electrodes connect directly to electrode pads, eliminating the need for bumps and internal connection terminals, and using an adhesive layer to bond the devices without gaps, thereby reducing thickness and enhancing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If internal connection terminals are used to electrically connect semiconductor devices, then electrical connection is achieved, but the device thickness increases
Solution Approach 1:
The patent extracts and eliminates the internal connection terminals (such as solder balls) from the electrical connection structure. Instead of using separate terminal elements, the invention directly connects electrode pads between stacked semiconductor devices, removing the thickness-consuming intermediate components while maintaining electrical connectivity.
Solution Approach 2:
The invention merges the electrical connection function with the bonding interface itself. By forming conductive connections directly at the bonding surfaces between stacked devices, the patent combines the mechanical bonding and electrical connection functions into a single integrated interface, eliminating the need for separate internal terminals.
2Ease of operation
If solder balls are used for electrical connections, then electrical connectivity is established, but connection reliability deteriorates
Solution Approach 1:
The patent removes solder balls from the connection structure entirely. By eliminating these spherical terminal elements, the invention avoids the reliability issues associated with solder ball connections such as poor wetting, void formation, and mechanical weakness, while maintaining ease of electrical connection through direct pad-to-pad bonding.
3Ease of manufacture
If gaps are left between semiconductor devices, then assembly is simplified, but device thickness increases
Solution Approach 1:
The invention merges the bonding interface and electrical connection interface into a single co-located structure. By forming conductive connections directly at the bonding surfaces, the patent eliminates the need for gaps between devices, allowing direct face-to-face contact between stacked semiconductor devices and reducing overall thickness.
Data Source
AI summary
An electronic device includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes a first electronic component, a first sealing resin, and a first multilayer interconnection structure including a first interconnection pattern directly connected to a first electrode pad of the first electronic component. The second semiconductor device includes a second electronic component, a second sealing resin, and a second multilayer interconnection structure including a second interconnection pattern directly connected to a second electrode pad of the second electronic component. The first semiconductor device is stacked on and bonded to the second semiconductor device through an adhesive layer with the first multilayer interconnection structure of the first semiconductor device facing toward the second sealing resin of the second semiconductor device. The first interconnection pattern and the second interconnection pattern are connected through a through electrode provided through the adhesive layer and the second sealing resin.