Stacked Semiconductor Device TSV Signal Latching
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Solution Overview
Problem
Semiconductor devices with stacked chips face challenges in reducing power consumption while maintaining high storage capacity.
Innovation Solution
The semiconductor device includes an external signal-inputting circuit, multiple signal-transmitting circuits, a command-delaying circuit, and an address-latching circuit, which receive and process external signals to generate internal clock, command, and address signals, allowing for efficient operation and data management between chips via through-silicon vias (TSVs).
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If stacked chips are used to provide massive storage capacity, then storage capacity is improved, but power consumption increases
Solution Approach 1:
The patent divides the memory system into multiple independent memory chips stacked vertically, with each chip containing its own address latching circuit. This segmentation allows each chip to operate independently with optimized power management, reducing overall power consumption while maintaining high storage capacity through the stacked configuration.
Solution Approach 2:
The patent transitions from a two-dimensional planar memory architecture to a three-dimensional stacked architecture using through-silicon vias (TSVs). This vertical stacking enables massive storage capacity by adding the height dimension, while the independent address latching circuits on each chip layer enable granular power management to reduce overall power consumption.
2Productivity
If multiple signal-transmitting circuits are used to transmit signals between chips, then data transmission efficiency is improved, but device complexity increases
Solution Approach 1:
The patent employs universal address latching circuits that can operate in multiple modes depending on the memory chip configuration. These circuits can latch addresses from different signal sources (external inputs or internal transmissions through TSVs) and generate appropriate control signals, reducing the need for separate dedicated circuits for each function and thereby managing complexity while maintaining high data transmission efficiency.
3Measurement precision
If address latching is performed based on delayed commands, then data accuracy is improved, but operation time increases
Solution Approach 1:
The patent implements preliminary address latching by delaying the command signal before it reaches the address latching circuit. This preliminary action ensures that the address is latched at the correct timing moment, improving data accuracy by preventing premature or incorrect latching, while the delay is optimized to be minimal to avoid excessive operation time.
Data Source
AI summary
A semiconductor device may be provided. The semiconductor device may include a first chip and a second chip. The second chip may be configured to receive signals from the first chip to generate a latch address based on the received signals from the first chip.