Stacked Semiconductor Apparatus with Uniform Connection Patterns
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Solution Overview
Problem
Conventional stacked semiconductor devices face challenges in economically implementing serial connection paths and accommodating large components, such as heat sinks, due to the need for different connection element layouts for each device, which complicates assembly, inventory, and design, and often requires additional substrate area or specialized layers.
Innovation Solution
The use of a similar connection pattern across stacked semiconductor devices, with vertically aligned inter-device, back-side, and vertical connection elements, allows for the implementation of both serial and parallel connection paths without requiring different layouts for each device, enabling efficient assembly and reducing inventory complexity, and allows for the incorporation of large components and thermal conduits within the stack.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If different connection element layouts are used for each device in stacked semiconductor devices, then serial connection paths can be implemented, but device complexity and assembly difficulty increase
Solution Approach 1:
The patent applies universality by designing a standardized connection element layout that can serve multiple functions across different devices in the stack. Each device uses the same connection pattern, allowing the connection elements to function as both inter-device connectors and as part of serial connection paths, eliminating the need for device-specific layouts.
Solution Approach 2:
The patent segments the connection functionality into standardized modules that can be repeatedly instantiated across devices. By dividing the connection system into discrete, identical connection elements that can be independently positioned and configured, the patent enables serial connection paths while maintaining layout consistency across all devices.
2Adaptability or versatility
If different connection element layouts are used for each device, then serial connection paths are possible, but assembly and inventory management become more difficult
Solution Approach 1:
The patent implements universality by creating a single standardized connection element layout that can be used across all devices in the stack. This standardized design allows for simplified inventory management where only one type of connection pattern needs to be manufactured and stored, while still enabling serial connection path functionality through proper positioning and configuration.
3Adaptability or versatility
If additional substrate area is allocated for connection elements, then serial connection paths can be implemented, but the device footprint increases
Solution Approach 1:
The patent applies dimensionality change by transitioning from horizontal substrate plane to vertical stacking dimension. Instead of expanding the substrate area horizontally to accommodate additional connection elements for serial paths, the patent utilizes the vertical dimension through multi-layer stacking, allowing connection elements to be positioned in different layers while maintaining a compact substrate footprint.
4Adaptability or versatility
If specialized layers are added to accommodate serial connection paths, then serial communication is enabled, but device complexity and fabrication difficulty increase
Solution Approach 1:
The patent applies universality by designing existing substrate layers to serve dual purposes: supporting both traditional parallel connection paths and new serial connection paths. By making the layers multi-functional rather than creating specialized dedicated layers, the patent enables serial communication while avoiding the fabrication complexity associated with additional specialized layer structures.
Data Source
AI summary
A stacked semiconductor apparatus and method of fabricating same are disclosed. The apparatus includes upper and lower semiconductor devices having a similar pattern of connection elements. When stacked connected the resulting plurality of semiconductor devices includes a serial connection path traversing the stack, and may also include parallel connection paths, back-side mounted large components, and vertical thermal conduits.