3D Stacked Semiconductor Device for High-Resolution xR Displays
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Solution Overview
Problem
Current display apparatuses for extended reality (xR) applications face challenges in achieving downsized, low-power, high-resolution, and high-color-reproducibility designs while maintaining reliability.
Innovation Solution
A semiconductor device structure comprising multiple layers, including a functional circuit for controlling pixel operations, storage units, and light-emitting elements, with Si transistors and OS transistors used for transistor components, and a light-transmitting member for sealing, enabling efficient power management and high-resolution display.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If display apparatus is downsized for xR applications, then portability and comfort are improved, but achieving high resolution and high emission luminance becomes more difficult
Solution Approach 1:
The patent transitions from planar 2D display architecture to 3D stacked architecture with multiple layers (first layer with functional circuit, second layer with pixel circuits, third layer with light-emitting elements). This vertical dimensionality change allows high-resolution pixel circuits to be accommodated in the third layer while maintaining compact overall device volume, resolving the contradiction between downsizing and achieving high resolution.
Solution Approach 2:
The display apparatus is segmented into functionally independent layers: first layer for functional circuits, second layer for pixel circuits, and third layer for light-emitting elements. This segmentation allows each layer to be optimized independently for its specific function, enabling high-resolution pixel circuits in the third layer while keeping the overall device compact.
2Length of moving object
If organic EL element structure is used, then backlight is eliminated achieving thin and lightweight design, but emission luminance and color reproducibility become challenging
Solution Approach 1:
By stacking light-emitting elements across multiple layers (second layer and third layer) rather than using a single planar layer, the total light emission area is increased in the vertical dimension. This allows high emission luminance to be achieved while maintaining thin overall device profile, as the increased emission area is distributed across layers rather than requiring larger lateral dimensions.
3Manufacturing precision
If multiple pixel circuits and light-emitting elements are integrated, then high resolution is achieved, but device complexity and power consumption increase
Solution Approach 1:
Pixel circuits are relocated to the second layer while light-emitting elements are placed in the third layer. This vertical separation allows high-resolution pixel circuits to be densely packed in the second layer without increasing lateral device footprint, and the third layer can accommodate corresponding light-emitting elements directly above, simplifying inter-layer connections and reducing overall device complexity despite high resolution requirements.
Solution Approach 2:
The device is segmented into distinct functional layers where pixel circuits (second layer) are electrically connected to light-emitting elements (third layer). This segmentation allows independent optimization of circuit density for high resolution while managing complexity through modular layer architecture, where each layer can be designed and manufactured separately.
4Use of energy by stationary object
If display apparatus is downsized, then power consumption is reduced, but heat dissipation and reliability become concerns
Solution Approach 1:
Heat dissipation pathways are extended into the vertical dimension through the multi-layer structure. Each layer (first layer with functional circuit, second layer with pixel circuits, third layer with light-emitting elements) can serve as a thermal management stage, distributing heat generation and dissipation across multiple vertical levels rather than concentrating thermal load in a single planar layer, thereby improving reliability while maintaining low power consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a compact, high-resolution, and reliable display apparatus with improved color reproducibility and reduced power consumption, suitable for xR applications.
Implementation Method 1
By applying a voltage to this element, light emission can be obtained from the light-emitting organic compound
Data Source
AI summary
A novel semiconductor device is provided. The semiconductor device includes a first layer; a second layer over the first layer; and a third layer over the second layer. The first layer includes a functional circuit including a first transistor, the second layer includes a plurality of pixel circuits each including a second transistor, the third layer includes a plurality of light-emitting elements, one of the plurality of pixel circuits is electrically connected to one of the plurality of light-emitting elements, the functional circuit has a function of controlling an operation of the pixel circuit, and the pixel circuit has a function of controlling emission luminance of the light-emitting element.