Stacked Sensor Connector Assembly for High Resolution and Low Dead Space
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing connector assemblies for sensor devices, such as digital X-ray panels, face challenges in achieving high resolution and minimizing dead space due to limitations in pin pitch and spacing, which affect the sizing and efficiency of the sensor system.
Innovation Solution
The proposed connector assembly includes multiple substrates with conductive traces and electronic components, featuring flexible substrates and different profiles, with input and output pins closely aligned to reduce dead space and accommodate smaller pixel sizes, utilizing charge-to-digital converters to efficiently connect sensor panels to circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the pin pitch is reduced to accommodate smaller pixel sizes, then the resolution is improved, but the dead space increases and manufacturing complexity increases
Solution Approach 1:
The patent transitions from a traditional planar connector layout to a three-dimensional stacked configuration where multiple connector layers are positioned at different heights. This vertical dimensionality allows input pins and output pins to be closely aligned without requiring excessive lateral spacing, thereby reducing dead space while maintaining small pin pitch for high resolution.
Solution Approach 2:
The patent implements a nested structure where one connector is positioned within or alongside another connector in a stacked arrangement. This nesting allows the connectors to share space efficiently, reducing the overall footprint and dead space while maintaining the required pin density for high-resolution sensor applications.
2Measurement precision
If the pin pitch is reduced to accommodate smaller pixel sizes, then the resolution is improved, but the device complexity increases
Solution Approach 1:
The patent divides the connector assembly into multiple separate connector layers, each handling specific pin connections. This segmentation allows each layer to be optimized independently for its specific function, simplifying the design and manufacturing of each individual connector while achieving the overall high-resolution goal through the combined stacked structure.
Solution Approach 2:
The stacked connector design creates a multi-functional assembly where each connector layer serves both as a connection interface and as part of the overall spatial optimization structure. The same connector structure simultaneously achieves pin alignment, signal transmission, and space efficiency, reducing overall device complexity despite the high pin density requirement.
3Area of stationary object
If connectors are closely aligned to reduce dead space, then the compactness is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent incorporates alignment features and positioning structures that are pre-formed during the manufacturing process. These preliminary alignment mechanisms ensure that when connectors are stacked and closely aligned, they automatically achieve the required pin-to-pin registration without requiring excessive post-assembly precision adjustment, thereby reducing dead space while managing manufacturing precision requirements.
Data Source
AI summary
A connector assembly is disclosed. The connector assembly can include first and second connectors. The first connector can include a first electronic component mounted on a first component mount region of the first substrate. The second connector can include a second electronic component mounted on a second component mount region of the second substrate. The first connector and the second connector have different profiles from each other as seen from a top plan view, and can have wider middle portions that overlap when assembled. The first connector can be configured to connect to a sensor panel and a first external substrate or component. The second connector can be configured to connect to the sensor panel and a second external substrate or component.