Stacked Sensor Module Layout for Compact Imaging Arrays

Solution Overview

Problem

Existing sensor modules face challenges in achieving compact and efficient designs while ensuring that components fit within their designated area without interfering with neighboring modules, particularly in imaging systems like CT devices and ultrasound systems.

Innovation Solution

A sensor module design featuring a device package with vertical interconnect structures, a processor die, radiation shield, and encapsulant, along with a flexible substrate and stiffener, which includes a low thermal expansion material to maintain stability and prevent interference, allowing for compact and efficient integration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of moving object

If sensor modules are integrated into compact arrays, then space utilization is improved, but thermal and mechanical interference between neighboring modules increases

Engineering Contradiction:

Improvemodule areaVSAvoidthermal interference

Core Design Contradiction:

Area of moving objectVSObject-affected harmful factors

Solution Approach 1:

The device is divided into separate functional layers: a first substrate containing circuitry, a second substrate containing the sensor array, and an intermediate substrate positioned between them. This segmentation allows thermal and mechanical isolation between neighboring modules while maintaining compact integration.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

An intermediate substrate is introduced as a mediator between the first substrate (with circuitry) and the second substrate (with sensor array). This intermediate layer acts as a thermal and mechanical barrier, preventing harmful interactions between adjacent modules while enabling signal transmission.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Area of moving object

If sensor modules are integrated into compact arrays, then space utilization is improved, but mechanical stability and alignment between components deteriorates

Engineering Contradiction:

Improvemodule areaVSAvoidcomponent alignment

Core Design Contradiction:

Area of moving objectVSStability of the object's composition

Solution Approach 1:

The device is divided into separate functional layers: a first substrate containing circuitry, a second substrate containing the sensor array, and an intermediate substrate positioned between them. This segmentation allows thermal and mechanical isolation between neighboring modules while maintaining compact integration.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

An intermediate substrate is introduced as a mediator between the first substrate (with circuitry) and the second substrate (with sensor array). This intermediate layer acts as a thermal and mechanical barrier, preventing harmful interactions between adjacent modules while enabling signal transmission.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Area of moving object

If components are tightly packed to reduce module size, then manufacturing complexity increases

Engineering Contradiction:

Improvemodule areaVSAvoidassembly complexity

Core Design Contradiction:

Area of moving objectVSDevice complexity

Solution Approach 1:

The device is divided into separate functional layers: a first substrate containing circuitry, a second substrate containing the sensor array, and an intermediate substrate positioned between them. This segmentation allows thermal and mechanical isolation between neighboring modules while maintaining compact integration.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

An intermediate substrate is introduced as a mediator between the first substrate (with circuitry) and the second substrate (with sensor array). This intermediate layer acts as a thermal and mechanical barrier, preventing harmful interactions between adjacent modules while enabling signal transmission.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design ensures compact integration of sensor modules in arrays without interference, maintaining thermal and mechanical stability, and supports various imaging applications such as CT, ultrasound, and nuclear imaging by effectively communicating signals and shielding sensitive components.

Implementation Method 1

a radiation shield mounted to the processor die... wherein the radiation shield is positioned between the processor die and the sensor die

Methodology Applied

Scientific EffectElectromagnetic radiation shielding: Faraday Cage

Implementation Method 2

which includes a low thermal expansion material to maintain stability and prevent interference

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS20260056335A1Sensor module

Publication Date: 2026.02.26 ANALOG DEVICES INC

AI summary

A sensor assembly for an imaging system is disclosed. The sensor assembly can include a sensor module having: a device package having a first vertical interconnect structure, a processor die electrically connected to the first vertical interconnect structure via conductive traces, a radiation shield mounted to the processor die, and an encapsulant in which the first vertical interconnect structure, the processor die, and the radiation shield are at least partially embedded within. The sensor assembly can also include a sensor die disposed over the device package and in electrical communication with the processor die. During operation of the sensor module, the first vertical interconnect structure can communicate signals from the sensor die to the processor die. The radiation shield can be positioned between the processor die and the sensor die. The sensor assembly can include a second vertical interconnect structure at least partially embedded in the encapsulant.