Stacked Sensor Module Redundancy for Magnetic Field Measurement
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Solution Overview
Problem
Existing sensor devices lack redundancy and reliability, particularly in safety-critical applications where single-point failures can lead to downtime and increased maintenance costs, and they often fail to accurately measure inhomogeneous magnetic fields.
Innovation Solution
A sensor device comprising two identical housings with integrated magnetic field sensors, stacked and connected via form-fitting mechanisms, allowing for redundant measurement and reduced measurement inaccuracy by aligning the magnetic field sensors' extension planes to minimize flux divergence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single sensor is used, then the device complexity is low, but the reliability and failure safety are insufficient
Solution Approach 1:
The sensor device is segmented into two separate housing units, each containing an identical magnetic field sensor. This segmentation allows the system to maintain low complexity within each individual sensor while achieving high reliability through redundancy. The two housings can be independently manufactured and tested, then combined to form the complete device with enhanced failure safety.
Solution Approach 2:
The invention changes the quantity parameter from one sensor to two sensors, fundamentally altering the reliability characteristics of the system. By duplicating the sensor unit, the system transitions from single-point failure vulnerability to redundant operation capability, where the device can continue functioning even if one sensor fails.
2Reliability
If two sensors are stacked to provide redundancy, then the reliability is improved, but the measurement precision in inhomogeneous magnetic fields deteriorates due to flux divergence
Solution Approach 1:
The two sensors are arranged in a stacked configuration along the vertical dimension, with their sensitive surfaces facing each other. This dimensional arrangement allows the sensors to measure the same magnetic field point from opposite directions, enabling redundancy while minimizing the impact of magnetic field inhomogeneity through proper geometric positioning.
Solution Approach 2:
The housings are designed with asymmetric features including stepped formations and protrusions that create form-fitting connections. This asymmetric design ensures precise alignment between the two sensors during assembly, positioning their sensitive surfaces in optimal relationship to each other and to the measurement point, thereby minimizing measurement errors in inhomogeneous fields.
3Reliability
If two housings are joined to form a module, then the redundancy and reliability are improved, but the manufacturing complexity increases
Solution Approach 1:
The device is divided into two separable housing units that can be manufactured independently using standard manufacturing processes. Each housing contains a complete sensor assembly that can be produced, tested, and quality-checked separately before final assembly, simplifying the manufacturing of individual components while enabling redundant system architecture.
Solution Approach 2:
Two independently manufactured housing units are merged through form-fitting connections created by stepped formations and protrusions. This merging process combines the manufacturing advantages of independent production with the reliability benefits of a unified redundant system, allowing standardization of components while achieving enhanced failure safety through their combination.
4Volume of moving object
If the sensors are positioned close together for compactness, then the volume is reduced, but the measurement accuracy in inhomogeneous magnetic fields decreases due to flux strength divergence
Solution Approach 1:
The sensors are positioned close together in the vertical dimension through stacking, achieving compact volume while maintaining accurate measurement. The face-to-face orientation along the vertical axis allows the sensors to sample the magnetic field at nearly the same spatial location, minimizing errors from field inhomogeneity despite the close proximity enabled by the stacked configuration.
Solution Approach 2:
The asymmetric stepped formations and protrusions are designed to position the sensor sensitive surfaces at precise relative locations that optimize measurement accuracy. This asymmetric geometry ensures that despite the compact stacked arrangement, the sensors are oriented and positioned to minimize exposure to magnetic flux divergence, maintaining measurement precision within a small volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides high failure safety, reduced downtime costs, and improved reliability by allowing duplicate measurements of magnetic field strength and temperature, with the average of sensor values reducing measurement inaccuracy and enabling continued operation even if one sensor fails.
Implementation Method 1
a first magnetic field sensor is formed on the top surface of the first semiconductor body... the first magnetic field sensor comprises a first main extension plane
Data Source
Figure 1~2
Figure 3a~3b
Figure 4
AI summary
A sensor device, having a first housing with a bottom side and a top side and a face side and a back side and a first side surface and a second side surface, whereby the face side and the back side and the two side surfaces are arranged between the top side and the bottom side and whereby in the first housing a first semiconductor body with a top surface and a back surface, and a first metal substrate, with a front side and a back side, and a plurality of metallic terminal contacts for electrical contacting of a first sensor are provided, whereby in each case a section of the plurality of terminal contacts penetrates the first housing on the face side, and whereby the first semiconductor body is arranged with the back surface on the front side of the first metal substrate, and the first sensor is formed on the top surface of the first semiconductor body, and a second housing with a bottom side and a top side and a face side and a back side and a first side surface and a second side surface, whereby the face side and the back side and the two side surfaces are arranged between the top side and the bottom side and whereby in the second housing a second semiconductor body with a top surface and a back surface, and a second metal substrate, with a front side and a back side and a plurality of metallic terminal contacts for electrical contacting of a second sensor are provided, whereby in each case a section of the plurality of terminal contacts penetrates the second housing on the face side, and whereby the second semiconductor body is arranged with the back surface on the front side of the second metal substrate, and the second sensor is formed on the surface of the second semiconductor body, and the two housings form a module, whereby the two housings are connected form-fittingly to one another in the shape of a stack by a fixing means in a way in which the bottom side of the first housing is joined to the bottom side of the second housing and the plurality of terminal contacts of the two housings point in the same direction.