Stacked Image Sensor Logic Layer Preprocessing Offloading
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Solution Overview
Problem
In stacked image sensors, the increased circuit area and power consumption result from mounting all image processing and encoding circuits on a logic circuit layer, which hinders miniaturization and efficiency.
Innovation Solution
The implementation of a stacked image sensor with a sensor layer and a logic circuit layer, where the logic circuit layer performs preprocessing and encoding of RAW data before demosaic processing, and the reproduction device handles subsequent image processing, reducing the circuit area and power consumption by offloading processing tasks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If all image processing and encoding circuits are mounted on the logic circuit layer, then complete image processing functionality is achieved, but circuit area increases and power consumption increases
Solution Approach 1:
The patent divides image processing into two segments: preprocessing (black level correction, noise removal, lens distortion correction) performed on the logic circuit layer of the stacked image sensor, and subsequent processing (demosaic processing, color space conversion, image encoding) performed on an external image processing device. This segmentation reduces the circuit area required on the sensor while maintaining complete processing functionality.
Solution Approach 2:
The patent extracts complex image processing functions (demosaic processing, color space conversion, encoding) from the logic circuit layer and relocates them to an external image processing device. This extraction significantly reduces the circuit area and power consumption on the sensor while preserving full processing capability.
2Adaptability or versatility
If all image processing and encoding circuits are mounted on the logic circuit layer, then complete image processing functionality is achieved, but power consumption increases
Solution Approach 1:
The patent segments power consumption across two devices: low-power preprocessing on the stacked image sensor and higher-power subsequent processing on an external device. This segmentation reduces the power consumption burden on the sensor while maintaining complete processing functionality.
Solution Approach 2:
The patent extracts power-intensive processing functions (demosaic processing, color space conversion, encoding) from the sensor to an external image processing device, thereby reducing the sensor's power consumption while preserving full processing capability.
3Area of stationary object
If preprocessing is performed on the logic circuit layer, then circuit miniaturization is achieved, but processing capability is reduced
Solution Approach 1:
The patent segments processing capability across two devices: preprocessing functions implemented on the logic circuit layer and subsequent processing functions implemented on an external image processing device. This segmentation maintains complete processing capability while enabling circuit miniaturization on the sensor.
Solution Approach 2:
The patent extracts complex processing functions from the sensor to an external device, allowing the sensor to be miniaturized while preserving overall system processing capability through the external device's complementary processing functions.
Data Source
AI summary
An imaging device according to the present disclosure includes: a sensor layer including a light receiving section that outputs a pixel signal corresponding to incident light, the sensor layer that outputs RAW data based on the pixel signal; and a logic circuit layer that is stacked on the sensor layer, and includes an image processing circuit and an encoder, the image processing circuit that performs at least some pieces of preprocessing of a plurality of pieces of preprocessing to be performed before demosaic processing on the RAW data from the sensor layer, and the encoder that encodes the RAW data having been subjected to the pieces of preprocessing by the image processing circuit.