Stacked Server Liquid Cooling Loops for Multi-Processor Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The rapid generation of heat by multiple processors in servers poses a challenge for effective heat dissipation, leading to potential damage and instability due to high temperatures.
Innovation Solution
A liquid cooling device with stacked motherboards and liquid cooling plates attached in a one-to-one correspondence, where two plates per motherboard are connected in series to form a loop, and multiple loops are connected in parallel, utilizing coolant flow for simultaneous heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple processors are used in series and parallel to improve computing power, then computing performance is improved, but heat generation increases leading to high temperature damage and instability
Solution Approach 1:
The patent applies liquid cooling technology by introducing a cooling liquid circulation system that flows through cooling channels in contact with processor surfaces. The cooling liquid absorbs heat from multiple processors through thermal conduction and convection, effectively reducing processor temperatures while maintaining high computing performance from multiple parallel processors.
2Device complexity
If a single liquid cooling plate forms a liquid cooling loop, then the cooling system is simple, but each liquid cooling plate requires a separate communication loop increasing space occupation and resource waste
Solution Approach 1:
The patent merges multiple liquid cooling plates into a single integrated cooling loop system. Multiple cooling plates are connected in series within one circulation loop, allowing the cooling liquid to sequentially pass through all processors. This consolidation reduces the number of separate pipelines and communication loops needed, decreasing space occupation while maintaining effective cooling of all processors.
3Volume of stationary object
If motherboards are stacked to reduce space, then space occupation is reduced, but heat dissipation becomes more difficult due to confined space
Solution Approach 1:
The patent implements a nested cooling structure where liquid cooling plates are integrated directly onto stacked motherboards. The cooling plates conform to the surfaces of processors on vertically stacked motherboards, allowing efficient heat extraction in a compact configuration. The cooling liquid flows through channels that adapt to the three-dimensional arrangement of stacked components, maintaining effective heat dissipation despite the confined vertical space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively dissipates heat from multiple heat generating elements, reducing space requirements and resource waste while ensuring stable and reliable processor operation, even in confined spaces.
Implementation Method 1
when coolant is supplied into the liquid cooling loop, the coolant flowing in the liquid cooling plate can dissipate heat from the corresponding heat generating element in time
Implementation Method 2
each liquid cooling plate is attached to a surface of the corresponding heat generating element
Data Source
AI summary
A liquid cooling device and a server are provided. The liquid cooling device includes at least two motherboards provided in a stack, and each motherboard being provided with at least two heat generating elements; and a plurality of liquid cooling plates attached to the plurality of heat generating elements in a one-to-one correspondence. Two liquid cooling plates corresponding to two heat generating elements on the same motherboard are connected in series form a liquid cooling loop, and a plurality of liquid cooling loops are connected in parallel.