Stacked Solar Cell and Drive Circuit Integration for Compact Chips
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Solution Overview
Problem
Existing methods fail to produce an electronic device with a drive circuit, a solar cell structure, and a capacitor-function portion in one chip, leading to high production costs and large device area requirements.
Innovation Solution
A method involving bonding a first wafer with solar cell structures and a second wafer with drive circuits and capacitor-function laminated portions, followed by wiring and dicing to create a compact electronic device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a drive circuit and solar cell are integrated in one chip, then device area is reduced, but manufacturing complexity increases
Solution Approach 1:
The device is divided into separate functional modules: a drive circuit module formed on a first substrate, and a solar cell module formed on a second substrate. These modules are manufactured independently and then bonded together, allowing each to be optimized separately while achieving integration in the final device.
Solution Approach 2:
A bonding process acts as an intermediary step between the separately manufactured drive circuit and solar cell modules. This bonding interface enables the integration of the two modules into one chip without requiring complex co-manufacturing processes.
2Ease of manufacture
If Si-based solar cell is used with drive circuit mounted, then manufacturing is simplified, but power receiving efficiency is low
Solution Approach 1:
The material parameter of the solar cell is changed from conventional Si-based material to compound semiconductor material. This parameter change significantly improves power receiving efficiency while the separate module manufacturing approach keeps the overall manufacturing process manageable.
3Reliability
If compound semiconductor solar cell is epitaxially grown on Si substrate, then power receiving efficiency is improved, but production cost increases
Solution Approach 1:
The device is divided into separate functional modules: a drive circuit module formed on a first substrate, and a solar cell module formed on a second substrate. These modules are manufactured independently and then bonded together, allowing each to be optimized separately while achieving integration in the final device.
Solution Approach 2:
The material parameter of the solar cell is changed from conventional Si-based material to compound semiconductor material. This parameter change significantly improves power receiving efficiency while the separate module manufacturing approach keeps the overall manufacturing process manageable.
4Reliability
If solar cell area is increased, then power receiving efficiency is improved, but device area requirement increases
Solution Approach 1:
The device transitions from a planar layout to a three-dimensional stacked configuration. The drive circuit module and solar cell module are arranged in different layers and bonded together, allowing the solar cell to have a larger effective area without increasing the device's footprint area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method results in a small-area electronic device with suppressed production costs by integrating a solar cell structure, diode circuit, and capacitor-function portion in one chip.
Implementation Method 1
A power receiving device for optical wireless power receiving is a solar cell
Implementation Method 2
a first wafer having a plurality of independent solar cell structures comprising a compound semiconductor, the solar cell structures being formed on a starting substrate by epitaxial growth
Data Source
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AI summary
The present invention is a method for producing an electronic device having a drive circuit including a solar cell structure, the method including the steps of: providing a first wafer having solar cell structures on a starting substrate and a second wafer having drive circuits formed, so that either one of the first wafer or the second wafer has a plurality of independent diode circuits and capacitor-function laminated portions; obtaining a bonded wafer by bonding so that the solar cell structures, the diode circuits, the capacitor-function laminated portions, and the drive circuits are superimposed; wiring; and dicing the bonded wafer. This provides: a method for producing an electronic device including a drive circuit, a solar cell structure, and a capacitor-function portion in one chip and having a suppressed production cost; and such an electronic device.