Stacked Solid-State Battery Assembly on Metal Substrates
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for stacking thin film solid-state batteries are not suitable for conductive substrates, leading to challenges in achieving smaller footprints and higher capacities, as insulating substrates are brittle and add complexity and cost, limiting the scalability and integration of these batteries into wearable electronics.
Innovation Solution
The use of metal substrates, such as stainless steel, with thin film batteries, and innovative stacking and connecting methods that allow for vertical stacking and flexible integration, using serpentine conductive structures and stretchable inks to maintain functionality and maximize volumetric energy density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If insulating substrates (glass, silicon, ceramics, plastics) are used for stacking thin film batteries, then the batteries can be fabricated on purely insulating substrates, but the substrates are brittle and add complexity and cost
Solution Approach 1:
The patent changes the substrate material parameter from traditional insulating materials (glass, silicon, ceramics, plastics) to metal substrates. This parameter change eliminates brittleness and reduces complexity while maintaining fabrication compatibility, directly resolving the contradiction between substrate stability and device complexity
Solution Approach 2:
The patent adapts known die stacking concepts originally developed for insulating substrates and applies them to metal substrates. By copying the stacking methodology and modifying it for conductive substrates, the patent maintains the benefits of standardized fabrication while eliminating the drawbacks of insulating substrate materials
2Area of stationary object
If multiple smaller batteries are stacked vertically to achieve smaller footprint, then the capacity range can be maintained with smaller area, but existing stacking methods are not suitable for conductive substrates
Solution Approach 1:
The patent creates a universal stacking methodology that works with both insulating and conductive substrates. By developing electrical connection techniques that accommodate metal substrates specifically, the patent extends the applicability of vertical stacking to diverse substrate types, enhancing adaptability while maintaining small footprint benefits
Solution Approach 2:
The patent modifies the electrical connection parameter to work with conductive substrates. By changing from insulating substrate connection methods to metal substrate-compatible methods (such as soldering or conductive adhesive), the patent enables vertical stacking on conductive substrates, resolving the adaptability constraint
3Ease of manufacture
If standard assembly techniques are used for integration, then the manufacturing process is simplified, but achieving high volumetric energy density and robustness becomes challenging
Solution Approach 1:
The patent segments the battery into modular unit cells that can be independently fabricated and then stacked. This segmentation allows each cell to be manufactured using standard thin film techniques on metal substrates, simplifying assembly while the precise stacking and electrical connection methods ensure high volumetric energy density and robust performance
Data Source
AI summary
A solid-state battery and a method of making the same are disclosed. The battery includes a base frame or support, first and second exterior contacts on the base frame/support, stacked solid-state battery unit cells, first and second electrical connections, and encapsulation in contact with the base frame/support, covering the solid-state battery unit cells and the electrical connections. Each stacked solid-state battery unit cell is on a metal substrate and has exposed cathode and anode current collectors. The electrical connections electrically connect the exposed cathode and anode current collectors to the first and second exterior contacts. The method includes forming the stacked solid-state battery unit cells on the base frame/support, forming the exterior contacts on the base frame/support, electrically connecting the exposed cathode and anode current collectors to the respective exterior contacts, and encapsulating the solid-state battery unit cells and the electrical connections.