3D Stacked Source-Channel Structure for High-Capacity Memory
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Solution Overview
Problem
There is a demand for electronic devices with high-performance, high-capacity data storage units that retain data even when power is turned off, and existing technologies have not adequately addressed this need.
Innovation Solution
The manufacturing method involves forming a first source layer with a trench, a first sacrificial layer, and a stacked structure of alternating material layers, creating openings and channels, and forming a second source layer coupled to channel layers through the removal of the sacrificial layer, resulting in a structure with improved conductivity and data retention capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional data storage units are used, then manufacturing is simpler, but data storage capacity and performance are insufficient
Solution Approach 1:
The patent transitions from planar (2D) data storage to three-dimensional (3D) stacked structures, vertically stacking multiple source layers, channel layers, and block layers to increase storage capacity while maintaining a compact footprint. This dimensional change allows multiple storage cells to occupy the same lateral space at different vertical levels.
Solution Approach 2:
The data storage unit is segmented into distinct functional layers including source layers, channel layers, and block layers, with each layer serving specific purposes. The source layers are further divided into first and second source layers with different conductivity types, enabling sophisticated data encoding and storage operations across multiple segmented components.
2Quantity of substance
If high-capacity stacked structures are implemented, then data storage capacity increases, but manufacturing difficulty increases
Solution Approach 1:
The patent forms the first source layer, first channel layer, and first block layer in a predetermined sequence before forming the second source layer and subsequent components. This preliminary action establishes a stable foundation and enables subsequent layers to be formed with precise alignment and controlled properties, simplifying the overall manufacturing process despite the complex final structure.
Solution Approach 2:
The first channel layer acts as an intermediary component between the first source layer and the first block layer, facilitating electrical connection and enabling the formation of complete storage cells. This intermediary layer allows the manufacturing process to proceed in modular stages, with each layer serving as a building block for the next.
3Speed
If fast read and write speeds are achieved, then performance improves, but data retention capability may be compromised
Solution Approach 1:
The patent employs parameter changes in the conductivity types of different source layers (first source layer with first conductivity type, second source layer with second conductivity type) to optimize both read/write speed and data retention. By varying electrical parameters across different layers and controlling doping concentrations, the device achieves high-speed operation while maintaining stable charge storage for data retention.
Data Source
AI summary
A method for manufacturing an electronic device includes forming a first source layer including a trench, forming a first sacrificial layer in the trench, forming a first structure over the first source layer, wherein the first structure includes first material layers and second material layers which are alternately stacked over the each other, forming first openings passing through the first structure and extending to the first sacrificial layer, forming first channel layers in the first openings, forming a slit passing through the first structure and extending to the first sacrificial layer, forming a second opening by removing the first sacrificial layer through the slit, and forming a second source layer in the second opening, wherein the second source layer is coupled to the first channel layers.