Stacked Spectrometer Assembly for Compact Stray-Light Control
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Solution Overview
Problem
Existing spectrometer devices face challenges in achieving a compact yet reliable design, particularly in integrating them into consumer devices with limited substrate or lateral space, while also dealing with issues of stray light and diffracted light that lead to faulty measurements.
Innovation Solution
A method of manufacturing a spectrometer device involves providing an electro-optical system and a readout integrated circuit (ROIC), bonding them to establish electrical connections, and arranging the ROIC between the electro-optical system and a circuit carrier, using adhesive materials for mechanical stabilization and potentially employing flip chip bonding processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If spectrometer devices are made compact to integrate into consumer devices, then the available substrate space is reduced, but measurement accuracy deteriorates due to increased sensitivity to stray light and diffracted light
Solution Approach 1:
The patent transitions from a planar substrate layout to a three-dimensional stacked architecture, placing the electro-optical system, ROIC, and circuit carrier in vertical layers. This dimensional change allows compact footprint while maintaining adequate optical path separation to reduce stray light interference.
Solution Approach 2:
The patent implements a nested structure where the ROIC is positioned between the electro-optical system and the circuit carrier, with each component embedded within the vertical stack. This nesting approach maximizes space utilization while maintaining functional separation.
2Area of stationary object
If spectrometer devices are made compact with densely packed systems, then the device footprint is reduced, but measurement reliability deteriorates due to stray light and diffracted light interference
Solution Approach 1:
By stacking components vertically rather than spreading them horizontally, the patent achieves compact footprint while the vertical separation between optical components reduces stray light and diffraction effects that plague densely packed planar designs.
Solution Approach 2:
The ROIC serves as an intermediary layer positioned between the electro-optical system and circuit carrier, providing both electrical connection and optical isolation that prevents stray light from reaching sensitive detection elements.
3Ease of manufacture
If conventional manufacturing methods are used for spectrometer devices, then manufacturing simplicity is maintained, but device compactness and integration capability into consumer devices are insufficient
Solution Approach 1:
The patent divides the spectrometer device into three separate manufacturable components (electro-optical system, ROIC, circuit carrier) that can be produced using conventional processes, then assembled through bonding. This segmentation allows each component to be optimized independently while achieving compact integration.
Solution Approach 2:
The patent combines multiple functional components into a single bonded assembly, merging the electro-optical system, ROIC, and circuit carrier into one compact unit that maintains manufacturing simplicity through standardized bonding processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a more compact and accurate spectrometer device that minimizes the risk of erroneous measurements due to stray light, enabling integration into smaller devices while maintaining precision and simplicity in manufacturing.
Implementation Method 1
bonding them to establish electrical connections, and arranging the ROIC between the electro-optical system and a circuit carrier, using adhesive materials for mechanical stabilization
Implementation Method 2
providing at least one electro-optical system configured for generating at least one electronic signal according to the electromagnetic radiation
Data Source
AI summary
Described herein is a method of manufacturing at least one spectrometer device for evaluating electromagnetic radiation. The method includes: a) providing at least one electro-optical system configured for generating at least one electronic signal according to the electromagnetic radiation; b) providing at least one readout integrated circuit (ROIC) for processing the at least one electronic signal; c) providing at least one circuit carrier; d) arranging the electro-optical system on the ROIC; e) bonding the electro-optical system and the ROIC to establish at least one electrical connection between the electro-optical system and the ROIC; and f) arranging the ROIC on the circuit carrier, such that the ROIC is located between the electro-optical system and the circuit carrier. Also described herein is a spectrometer device for evaluating electromagnetic radiation.