Stacked SSD Package Substrates for Compact High-Capacity Storage
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Solution Overview
Problem
There is a demand for solid state drive apparatuses with high performance and small size, but existing technologies struggle to minimize the volume of these devices while maintaining performance.
Innovation Solution
The proposed solid state drive apparatus features a housing with a top cover and a bottom cover that accommodates two package substrate modules separated vertically. The modules include top and bottom package base substrates with protrusions and notches, which are securely fixed using protruding bar and round pressing/sitting portions on the covers, allowing for efficient electrical connection via a flexible printed circuitry connector.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple package substrate modules are accommodated in the housing, then storage capacity is improved, but device volume increases
Solution Approach 1:
The patent transitions from horizontal arrangement to vertical stacking of package substrate modules. The housing includes a top cover and a bottom cover with corresponding pressing portions and seating portions that apply pressure in the vertical direction to fix the stacked modules, thereby increasing storage capacity without proportionally increasing device volume.
Solution Approach 2:
The patent implements a nested structure where multiple package substrate modules are stacked within the housing space. The top package substrate module is positioned above the bottom package substrate module, with both modules contained within the same housing boundaries, effectively nesting components to maximize space utilization.
2Volume of stationary object
If package substrate modules are stacked vertically, then device volume is reduced, but electrical connection reliability deteriorates
Solution Approach 1:
The top cover and bottom cover are pre-equipped with pressing portions and seating portions respectively, positioned before assembly. These features are designed to automatically align and apply pressure to the corresponding portions of the package substrate modules during assembly, ensuring reliable electrical connections are established in advance before the device is fully assembled.
Solution Approach 2:
The connection member serves as an intermediary component between the top package substrate module and the bottom package substrate module. It facilitates electrical connection between the stacked modules while being positioned within the vertical space of the housing, mediating the connection without requiring direct contact between the modules.
3Manufacturing precision
If pressing portions are used to fix modules, then module positioning precision is improved, but manufacturing complexity increases
Solution Approach 1:
The patent merges the functions of fixation and positioning into a single integrated structure. The pressing portions on the top cover and seating portions on the bottom cover are designed to simultaneously achieve both functions by applying pressure to the corresponding portions of the package substrate modules, eliminating the need for separate fixation and positioning mechanisms.
Solution Approach 2:
The top cover and bottom cover serve multiple functions: they enclose the housing, provide structural support, and contain the pressing portions and seating portions that fix and position the package substrate modules. This multi-functionality reduces the overall number of components and simplifies the manufacturing process while maintaining positioning precision.
Data Source
AI summary
A solid state drive apparatus includes a housing including a top cover and a bottom cover that define an internal space of the housing, and a plurality of package substrate modules accommodated in the internal space of the housing. The package substrate modules include a top package substrate module having a top package base substrate, and a bottom package substrate module having a bottom package base substrate. The top package substrate module and the bottom package substrate module are separated from each other in a vertical direction. The top package base substrate includes a plurality of top protrusions and a plurality of top notches, and the bottom package base substrate includes a plurality of bottom protrusions and a plurality of bottom notches.