Stacked Storage Module for High-Density Server Loading
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Solution Overview
Problem
Conventional 4U tower-typed server apparatuses are limited in the number of hard disk units they can load due to space constraints, leading to increased volume, complex manufacturing processes, high costs, and inconvenient maintenance, as the arrangement of hard disk units exposes edges, reduces circuit space, and complicates the product process.
Innovation Solution
A storage unit combining module and a related server apparatus that allows for the simultaneous loading of multiple storage units using a base with specific positioning zones and a circuit backboard without vent holes, enabling flexible connection and single-sided production, and a storage unit moving suit connected via flexible cables for easy replacement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If hard disk units are arranged side by side in frames to expose edges for easy access, then ease of operation is improved, but the quantity of storage units that can be loaded is limited by the apparent surface area
Solution Approach 1:
The patent transitions from a two-dimensional side-by-side arrangement to a three-dimensional stacked configuration. Storage units are arranged vertically in layers within the same footprint area, utilizing the vertical dimension to increase capacity while maintaining front-accessibility through the stackable frame structure
2Temperature
If vent holes are formed on the hard disk backboard for heat dissipation, then heat dissipation is improved, but circuit allocation space is decreased and manufacturing complexity increases
Solution Approach 1:
The patent extracts the heat dissipation function from the circuit backboard by removing vent holes. Instead, dedicated heat dissipation structures are integrated separately, allowing the backboard to be a solid, continuous surface that simplifies manufacturing while heat management is handled by specialized components positioned near the storage units
3Temperature
If the hard disk backboard uses a double-sided product process to detour vent holes, then heat dissipation is maintained, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent converts the potential harm of removing vent holes (reduced heat dissipation) into a benefit by implementing alternative heat dissipation pathways through dedicated structures. The solid backboard becomes beneficial by eliminating manufacturing complexity while heat management is achieved through integrated thermal management components
Data Source
AI summary
A storage unit combining module capable of loading a plurality of storage units, and a storage unit moving suit having several storage unit combining modules and a related server apparatus are disclosed. The storage unit combining module includes a base, a circuit backboard and a signal adapter. The base has several positioning zones and an open zone. The circuit backboard includes a first section and a second section bent from each other. The circuit backboard further includes a plurality of connectors respectively disposed on the corresponding positioning zones. The signal adapter is disposed on the open zone and electrically connected to the second section. Two storage units are respectively loaded into two positioning zones on a right side of the base in a first inserting direction, and one storage unit is further loaded into a single positioning zone on a left side of the base in a second inserting direction.