Stacked Stud Bump Semiconductor Package for Compact RF Modules
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Solution Overview
Problem
In base stations or mobile phone communication systems, the need for compact semiconductor devices is increasing due to the large number of transistors in each module, and existing semiconductor devices are not adequately compact.
Innovation Solution
A semiconductor device design that includes a substrate with stacked stud bumps on gate and drain pads, eliminating the need for leads, and an insulating resin layer around these bumps, allowing for compact size adjustment and electrical coupling through solder balls, while incorporating a nitride semiconductor layer for high-frequency operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional lead-based semiconductor devices are used, then electrical connection is achieved, but device size becomes large and compactness is reduced
Solution Approach 1:
The patent extracts and eliminates the lead structure from the semiconductor device, replacing it with direct bump connections between the semiconductor chip and substrate. This removes the unnecessary lead components while maintaining electrical connection functionality, thereby reducing device volume and improving compactness.
Solution Approach 2:
The patent transitions from a planar lead-based connection structure to a vertical bump-based connection structure. By stacking stud bumps vertically on the chip surface and connecting them to substrate pads, the design utilizes the vertical dimension to achieve compact integration without requiring lateral lead extensions.
2Ease of manufacture
If multiple leads are used for electrical connection, then connectivity is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent merges the functions of multiple leads into integrated bump structures. Instead of separately routing and connecting multiple leads, the stud bumps and solder bumps perform both mechanical support and electrical connection functions in a single integrated structure, simplifying the manufacturing process.
Solution Approach 2:
The patent replaces the mechanical lead system with a bump-based direct connection system. The bump structures provide both mechanical support and electrical conductivity, eliminating the need for separate mechanical lead components and their associated assembly processes.
3Volume of moving object
If compact design is implemented, then device size is reduced, but electrical coupling stability may be compromised
Solution Approach 1:
The patent uses vertical stacking of bump structures (stud bumps + solder bumps) to achieve compact lateral dimensions while maintaining reliable electrical coupling through the vertical connection path. The multi-layer bump structure provides stable electrical coupling without requiring large lateral footprints.
Solution Approach 2:
The patent employs composite bump structures combining different materials and functions: stud bumps provide structural support and initial electrical connection, while solder bumps provide reliable final electrical coupling and mechanical bonding. This composite approach ensures both compactness and electrical coupling stability.
Data Source
AI summary
A semiconductor device includes a substrate having a first main surface and a second main surface opposite the first main surface. The semiconductor device includes a gate pad and a drain pad provided on the first main surface, and includes a source pad provided on the second main surface. The semiconductor device includes a first bump provided on the gate pad, the first bump including a plurality of first stud bumps stacked over one another. The semiconductor device includes a second bump provided on the drain pad, the second bump including a plurality of second stud bumps stacked over one another. The semiconductor device includes an insulating resin layer provided around the first bump and the second bump.