Stacked Substrate Alignment Correction Across Processing and Stacking

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Solution Overview

Problem

In stacked substrate manufacturing, positional misalignment among substrates is a persistent issue due to various causes, requiring effective correction methods to achieve predetermined alignment accuracy.

Innovation Solution

A manufacturing method and device that include a processing unit for forming substrates and a stacking unit for correcting positional misalignment, utilizing a control system to decide and apply correction amounts based on measured misalignment, allowing for both common and individual corrections during processing and stacking to ensure precise alignment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If multiple substrates are stacked to form a stacked substrate, then the functionality and integration density are improved, but positional misalignment among substrates occurs due to various causes

Engineering Contradiction:
Improveintegration densityVSAvoidpositional alignment accuracy
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent measures positional misalignment among substrates before final stacking and applies correction amounts to adjust the positions. This preliminary measurement and correction action prevents misalignment from affecting the final stacked substrate quality, resolving the contradiction between achieving high integration density through stacking and maintaining positional alignment accuracy.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent implements a feedback mechanism where positional misalignment is measured, correction amounts are calculated based on the measured values, and these correction amounts are applied to adjust substrate positions. This closed-loop feedback system ensures that stacking operations achieve high integration density while maintaining precise positional alignment by continuously monitoring and correcting misalignment.

Inventive Principle:
Principle #23Feedback

2Manufacturing precision

If correction amounts are applied to substrates during processing and stacking, then positional alignment accuracy is improved, but the complexity of the manufacturing process increases

Engineering Contradiction:
Improvepositional alignment accuracyVSAvoidprocess complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent divides the correction process into distinct segments: measurement of positional misalignment, calculation of correction amounts, and application of corrections during processing and stacking. This segmentation allows each function to be performed by specialized components, improving positional alignment accuracy while managing process complexity through modular organization of correction operations.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS20240404987A1Method and device for manufacturing stacked substrate
Publication Date: 2024.12.05 NIKON CORP
  • US20240404987A1 patent drawing
  • US20240404987A1 patent drawing
  • US20240404987A1 patent drawing

AI summary

A manufacturing method is provided, which includes processing at least one of a plurality of substrates; stacking the plurality of substrates to manufacture a stacked substrate; and correcting, in the processing, a part of an amount of positional misalignment that is generated among a plurality of substrates in the stacking and correcting, in the stacking, at least a part of the remainder of the amount of positional misalignment.