Stacked Wiring Substrate Corner Antenna Placement
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Solution Overview
Problem
The downsizing of electronic devices is hindered by the size of chip antennas, as existing designs require protrusions to prevent radio wave shielding by ground patterns, limiting the effectiveness of Package on Package (POP) configurations in wireless communication devices.
Innovation Solution
The electronic device design features first and second wiring substrates with ground patterns formed around their corners, allowing the chip antenna to be placed at the corner of the second substrate, avoiding shielding and creating a large ground region next to the antenna for improved antenna characteristics by electrical connection through terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the chip antenna is placed on the wiring substrate, then wireless communication function is achieved, but the antenna size prevents device downsizing
Solution Approach 1:
The patent transitions from a planar arrangement to a three-dimensional stacked configuration by placing the second wiring substrate (with antenna) above the first wiring substrate. This vertical stacking enables device downsizing in the planar direction while maintaining adequate antenna operating space in the vertical dimension.
Solution Approach 2:
The device is divided into multiple wiring substrates (first and second wiring substrates) with distinct functions. The first wiring substrate handles ground patterns and shielding, while the second wiring substrate carries the antenna and signal transmission, allowing each component to be optimized independently.
2Reliability
If ground patterns are formed near the antenna, then shielding effectiveness is improved, but radio wave transmission is blocked
Solution Approach 1:
The ground patterns are arranged in the vertical dimension on different wiring substrates rather than in the planar dimension near the antenna. The first wiring substrate contains ground patterns that provide shielding, while the second wiring substrate contains the antenna, separating these functions spatially to avoid mutual interference.
Solution Approach 2:
The first wiring substrate acts as an intermediary between the antenna and the ground patterns. It provides a physical separation and electrical isolation that allows the ground patterns to maintain their shielding function without blocking radio waves from the antenna on the second wiring substrate.
3Object-generated harmful factors
If the antenna protrudes laterally to avoid ground pattern shielding, then radio wave transmission is improved, but device downsizing is prevented
Solution Approach 1:
Instead of making the antenna protrude laterally in the planar direction, the patent positions the antenna on the second wiring substrate which is stacked vertically above the first wiring substrate. This vertical arrangement provides sufficient space for the antenna while maintaining a compact planar footprint for device downsizing.
Data Source
AI summary
An electronic device includes a first wiring substrate having a first corner part, a first ground pattern formed on a lower surface of the first wiring substrate with avoiding the first corner part, a second ground pattern formed on an upper surface of the first wiring substrate with avoiding the first corner part, a second wiring substrate provided above the first wiring substrate and including a second corner part above the first corner part, a third ground pattern formed on a lower surface of the second wiring substrate with avoiding the second corner part, a fourth ground pattern formed on an upper surface of the second wiring substrate with avoiding the second corner part, a plurality of terminals electrically connected to each of the first, second, third and fourth ground patterns, and an antenna fixed to the upper surface of the second wiring substrate at the second corner part.