Stacked Substrate Separation Using Laser Modification Lines
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Solution Overview
Problem
In the manufacturing of stacked substrates for electronic devices, existing cutting methods such as blade dicing and laser ablation result in significant waste due to cutting allowances, limiting the efficiency and yield of chip production.
Innovation Solution
A method involving the attachment of a stretchable member to a stacked substrate, followed by the formation of modification lines using a laser beam to facilitate precise division of the substrate without generating cutting allowances, allowing for efficient separation of individual chips without waste.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If blade dicing or laser ablation method is used to cut stacked substrate, then cutting can be performed, but cutting allowance portion is wasted
Solution Approach 1:
The patent applies preliminary action by forming modification lines in the substrate before the actual cutting process. The laser beam irradiates the substrate to create modified regions that serve as predetermined cutting paths, allowing the blade to follow these pre-established lines without requiring additional cutting allowances for positioning and depth control.
Solution Approach 2:
The patent replaces the traditional mechanical cutting approach with a hybrid method where laser irradiation creates modification lines that guide subsequent blade cutting. This substitution of mechanical precision requirements with optical field-based modification reduces the need for cutting allowances while maintaining high cutting precision.
2Productivity
If cutting allowance is used in stacked substrate, then reliable cutting can be achieved, but the number of usable chips decreases
Solution Approach 1:
By pre-forming modification lines through laser irradiation across the entire stacked substrate, the patent establishes reliable cutting paths before separation. This preliminary modification ensures that each chip will be cleanly separated along the intended lines without requiring excessive cutting allowances, thereby maximizing chip yield while maintaining cutting reliability.
Solution Approach 2:
The patent segments the cutting process into two distinct stages: first, forming modification lines that define the cutting paths; second, following these lines for actual separation. This segmentation allows precise control over where cuts occur, eliminating the need for large cutting allowances and increasing the number of usable chips from each stacked substrate.
3Ease of manufacture
If stretchable film is attached to wafer for cutting, then cutting can be performed, but process complexity increases
Solution Approach 1:
The patent extracts and eliminates the stretchable film step from the traditional cutting process. By using laser-induced modification lines directly on the substrate, the method removes the need for attaching and manipulating external stretchable films, thereby simplifying the overall manufacturing process while maintaining the ability to perform precise cuts on stacked substrates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces waste and increases the number of usable electronic devices produced from stacked substrates by eliminating the need for cutting allowances, while maintaining a clean environment and simplifying the manufacturing process.
Implementation Method 1
forming at least one first modification line by irradiating the first substrate with a laser beam
Implementation Method 2
stretching the stretchable member to divide the first substrate along the at least one first modification line
Data Source
AI summary
A method for manufacturing an electronic device includes a stretchable member attachment step of attaching stretchable member 21 to first substrate 2 on which second substrate 3 is stacked, a first modification line formation step of forming one or more first modification lines 22 by irradiating the first substrate 2 with a laser beam, and a dividing step of stretching the stretchable member 21 to divide the first substrate 2 along the one or more first modification lines 22.