Stacked Substrate Package Layout for Compact Electrical Interconnects

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Solution Overview

Problem

There is a need for packages with substrates and integrated devices that provide better performance and reduced size, while maintaining efficient electrical connections.

Innovation Solution

A package design comprising a first and second substrate with integrated devices between them, encapsulated by an encapsulation layer, allowing for compact form factor and efficient electrical connections through multiple interconnects and adhesive materials.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multiple integrated devices are stacked between substrates, then the electrical connection performance is improved, but the package size reduction is limited

Engineering Contradiction:

Improveelectrical connection performanceVSAvoidpackage size

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The patent transitions from planar arrangement to three-dimensional stacking by placing first and second integrated devices between first and second substrates in vertical layers. The encapsulation layer seals this vertical structure, creating a compact Z-axis arrangement that improves electrical connection performance while controlling package volume through spatial dimensionality change.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent implements nested arrangement where integrated devices are positioned within the vertical space between substrates. The first integrated device is coupled to the first substrate, and the second integrated device is coupled to the second substrate, with both devices nested within the encapsulated volume, maximizing space utilization and reducing overall package size.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Ease of manufacture

If substrates are coupled with integrated devices using traditional methods, then manufacturing is simple, but the package form factor is enlarged

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidpackage form factor

Core Design Contradiction:

Ease of manufactureVSVolume of moving object

Solution Approach 1:

The patent divides the package into distinct functional segments: first substrate, first integrated device, second integrated device, second substrate, and encapsulation layer. Each segment is independently prepared and then assembled through coupling, allowing modular manufacturing that simplifies production while achieving compact form factor through precise integration of segmented components.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The package employs composite structure combining different material types: substrates (likely ceramic or PCB material), integrated devices (semiconductor), and encapsulation layer (mold compound or epoxy). This composite approach enables optimized electrical and mechanical properties while maintaining compact dimensions through material-specific functionality.

Inventive Principle:

Principle #40Composite materials

Data Source

PatentUS20250273585A1Package comprising substrates and integrated devices

Publication Date: 2025.08.28 QUALCOMM INC

AI summary

A package comprising a first substrate; a first integrated device coupled to the first substrate; a second substrate; a second integrated device coupled to the second substrate; and an encapsulation layer coupled to the first substrate and the second substrate, wherein the encapsulation layer, the first integrated device and the second integrated device are located between the first substrate and the second substrate.