Stacked Substrate Processing Modules with Dual Transfer Paths
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Solution Overview
Problem
The existing coating/developing apparatuses in semiconductor manufacturing face challenges in enhancing throughput while minimizing footprint, particularly due to the increased load on transfer mechanisms and the large occupied area required by additional modules such as the rear surface cleaning module.
Innovation Solution
A substrate processing apparatus is designed with a carrier block, an end block, and a middle block, where the middle block includes multiple processing modules stacked vertically, and utilizes two substrate transfer mechanisms: one for transferring substrates through the processing modules and another for direct transfer between the carrier and end blocks, reducing the load on the first mechanism and minimizing footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If additional modules such as rear surface cleaning module and protective film forming module are installed in the rear processing block, then the functionality and versatility of the apparatus is improved, but the load on transfer mechanism increases and throughput cannot be sufficiently enhanced
Solution Approach 1:
The patent introduces a vertical dimension by stacking processing modules vertically in the middle block, allowing multiple processing functions to be arranged in the vertical direction rather than horizontally. This enables increased functionality without increasing the horizontal footprint or overloading the transfer mechanism, as substrates can be processed in parallel across multiple vertical levels.
Solution Approach 2:
The patent divides the processing system into distinct functional blocks: carrier block for substrate loading, middle block with vertically stacked processing modules, and end block for substrate return. This segmentation allows independent optimization of each block and enables parallel processing operations that enhance throughput without increasing transfer mechanism load.
2Area of stationary object
If rear surface cleaning module is installed in the interface block, then the occupied floor area of subsequent stage is reduced, but the number of additional modules required increases and footprint cannot be sufficiently suppressed
Solution Approach 1:
The middle block is designed as a multi-functional unit that combines substrate transfer capability with multiple vertically stacked processing modules. This universal block can perform various processing operations (cleaning, protective film formation, etc.) without requiring separate dedicated blocks, thereby reducing the total number of modules needed while minimizing footprint.
Solution Approach 2:
The patent implements a nested structure where multiple processing modules are vertically stacked within the middle block, with processing modules arranged one above another. This nesting approach allows multiple functions to be contained within a compact vertical space, reducing the horizontal footprint and minimizing the number of additional modules required.
Data Source
AI summary
A substrate processing apparatus includes a carrier block, an end block for returning a substrate picked up from the carrier block to the carrier block, and a middle block. The middle block includes a plurality of first processing modules stacked one above another, each being configured to process the picked-up substrate and directed to the end block or the substrate returning from the end block to the carrier block; a first transfer mechanism for vertically moving to transfer the substrate that is transferred from one of the carrier and end blocks to the middle block, to a respective one of the first processing modules, and delivering the substrate to the other of the carrier and end blocks; and a second transfer mechanism for transferring the substrate from the other of the carrier and end blocks to the one thereof, without passing through the plurality of first processing modules.