Radiation Thermometer Stacked Substrates for Compact Noise-Resistant Circuits
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Solution Overview
Problem
Existing radiation thermometers face challenges in downsizing while maintaining circuit scale and are vulnerable to electromagnetic noise due to minimal circuit accommodation and analog signal transmission.
Innovation Solution
The radiation thermometer is configured with a signal processing unit comprising multiple stacked substrates separated by spacers, connected via inter-substrate connectors, and fixed with elastic members, with heat dissipation and thermal separation of components to reduce noise and heat interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the measurement unit is downsized to accommodate only the infrared sensor or minimal circuit, then the size of the measurement unit is reduced, but the configuration becomes weak against electromagnetic noise
Solution Approach 1:
The patent applies three-dimensional stacking of multiple substrates (sensor substrate, signal processing substrate, power supply substrate) vertically within the casing. This vertical arrangement increases the effective circuit accommodation space without increasing the horizontal footprint, enabling both downsizing and enhanced EMC performance by accommodating more circuits in the same volume.
2Volume of moving object
If only minimal circuit is accommodated in the casing, then the measurement unit can be downsized, but the analog signal output is vulnerable to electromagnetic noise
Solution Approach 1:
The patent merges multiple functional circuits (signal processing, power supply, analog-to-digital conversion) into a integrated multi-substrate system within the same casing. This allows the analog signal to be converted to digital signal before leaving the measurement unit, and all circuits to be housed together, reducing vulnerability to external electromagnetic noise while maintaining compact size.
3Adaptability or versatility
If multiple substrates are stacked to increase circuit scale, then the circuit functionality is enhanced, but the structural stability and fixing reliability may be compromised
Solution Approach 1:
The patent implements a nested substrate structure where multiple substrates (sensor substrate, signal processing substrate, power supply substrate) are stacked vertically one on top of another within the casing. Each substrate is positioned and fixed relative to the others, creating a stable integrated assembly that maximizes space utilization while maintaining structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for downsizing and increased circuit scale, enabling digital signal output resistant to electromagnetic noise and improved measurement accuracy by reducing thermal interference.
Implementation Method 1
the radiation thermometer is configured to detect infrared rays emitted from a measurement target with an infrared detection element (infrared sensor) so as to be able to measure the temperature of the measurement target based on the detected intensity
Implementation Method 2
it is desirable that the plurality of substrates be fixed to the casing with an elastic member interposed therebetween
Implementation Method 3
it is desirable that the first substrate be provided in contact with the casing or provided with a heat dissipation member interposed between the first substrate and the casing. With this configuration, the heat generated in the substrate can be released to the casing
Data Source
AI summary
The present invention downsizes a radiation thermometer and increases a circuit scale, and includes: an infrared sensor; a signal processing unit that processes a signal of the infrared sensor; and a casing that accommodates the infrared sensor and the signal processing unit, in which the signal processing unit is configured by stacking a plurality of substrates with a spacer interposed therebetween.