Stacked Substrate Sensing Device with Sealed Chambers
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Solution Overview
Problem
Integrating multiple sensing elements with different environmental condition requirements on a single semiconductor substrate is challenging due to the difficulty in creating independent chambers with varying conditions, and conventional sealing methods often result in poor tightness and contamination of the sensing elements.
Innovation Solution
A sensing device and manufacturing method that utilize multiple substrates to create independent chambers with different environmental conditions, such as pressure and gas compositions, by stacking substrates and using cover plates to seal channels, eliminating the need for extra filling materials and ensuring tightness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple sensing elements with different environmental requirements are integrated on a single substrate, then device functionality and versatility are improved, but the complexity of creating independent chambers with different environmental conditions increases
Solution Approach 1:
The device is divided into multiple independent chambers, each capable of maintaining different environmental conditions. Each chamber is formed by the stacking substrate structure with individual sealing, allowing different sensing elements to operate in their respective optimal environments (vacuum, atmospheric pressure, specific gas compositions) without interfering with each other.
Solution Approach 2:
Multiple chambers are nested within the stacking substrate structure, with each chamber containing a sensing element. The chambers are hierarchically organized within the same substrate assembly, enabling compact integration of multiple sensing functions while maintaining independent environmental control for each chamber.
2Ease of manufacture
If conventional sealing methods (re-soldering, deposition filling) are used to seal chambers, then chamber formation is simplified, but the sealing tightness deteriorates and contamination of sensing elements occurs
Solution Approach 1:
The conventional mechanical sealing methods (re-soldering, deposition filling) are replaced with a structural sealing approach using the stacking substrate design. The chambers are sealed through the inherent structure of the stacked substrates themselves, eliminating the need for additional sealing materials or processes that compromise tightness or contaminate sensing elements.
Solution Approach 2:
The stacking substrate structure serves multiple functions simultaneously: it forms the chamber walls, provides the sealing mechanism, and supports the sensing elements. This multi-functional design eliminates the need for separate sealing components or materials, achieving both ease of manufacture and high sealing reliability.
3Ease of manufacture
If filling materials are used to seal chamber channels, then channel sealing is achieved, but the sensing elements are contaminated and manufacturing precision deteriorates
Solution Approach 1:
The sealing function is extracted from the channel-filling process and integrated into the substrate structure itself. The stacking substrate design inherently provides channel sealing through its construction, eliminating the need to introduce filling materials that would contaminate sensing elements or compromise manufacturing precision.
Data Source
AI summary
A sensing device can be provided with sealed and open-type chambers in various conditions for accommodating different types of sensing structural components by stacking multiple substrates, wherein the condition of a sealed chamber depends on condition taken in substrate bonding process. Owing to sealing a channel of the sealed chamber by the substrate, superior sealing performance is achieved as compared to those adopting solder or sealing material, and thus the condition of the sealed chamber can be finely controlled.