Stacked Substrate Sealing via Solder Blockers
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Solution Overview
Problem
The existing methods for sealing gaps between substrates and frames in stacked circuit boards, using insulating colloids, are economically disadvantageous and difficult to control, leading to inefficiencies in manufacturing and potential short circuits.
Innovation Solution
The use of blockers, made of solder alloys like tin, silver, or copper, surrounding conductors to create a sealed connection between substrates and frames, eliminating the need for colloid injection and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If insulating colloid injection method is used to seal gaps between substrates and frame, then short circuit prevention is improved, but manufacturing complexity and process difficulty increase
Solution Approach 1:
The patent extracts and eliminates the insulating colloid injection process from the manufacturing workflow. Instead of injecting colloid to seal gaps, the design uses a frame with integrated hollow structures that inherently prevent conductive substance penetration, thereby removing the complex injection process while maintaining short circuit prevention capability
Solution Approach 2:
The patent introduces an intermediary structure - the hollow space within the frame - that acts as a barrier between the conductive substances and the welding pads. This intermediary hollow structure prevents direct contact and potential short circuits without requiring additional sealing materials or processes
2Reliability
If insulating colloid is injected to seal gaps, then electrical insulation is improved, but production efficiency decreases
Solution Approach 1:
The patent implements preliminary action by designing the frame with pre-formed hollow sealing structures before the coating process begins. The gaps are inherently sealed by the frame's geometry, eliminating the need for post-assembly colloid injection and thereby improving production efficiency while maintaining electrical insulation
Solution Approach 2:
The patent removes the time-consuming colloid injection step from the manufacturing process. The frame's hollow structures provide inherent sealing, allowing the coating process to proceed without interruption for gap sealing, thus enhancing production efficiency
3Reliability
If multiple manufacturing processes including colloid injection are used, then sealing reliability is improved, but manufacturing cost increases
Solution Approach 1:
The patent merges the sealing function into the frame structure itself. The hollow spaces within the frame serve both structural and sealing purposes, combining multiple functions into a single component and eliminating the need for separate sealing materials and processes, thereby reducing manufacturing cost
4Reliability
If colloid injection is used to prevent conductive substance penetration, then circuit protection is improved, but process control difficulty increases
Solution Approach 1:
The patent eliminates the colloid injection process entirely, removing the associated control difficulties. The frame's hollow structures provide passive, inherent sealing that does not require precise control of injection parameters, material viscosity, or timing, thereby simplifying process control while maintaining circuit protection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution prevents short circuits and manufacturing inefficiencies by ensuring a sealed connection between substrates and frames, enhancing production efficiency and reducing the complexity of the manufacturing process.
Implementation Method 1
The first substrate and the first frame are connected in a sealed manner through the first blockers combined by the solder, while the second substrate and the first frame are connected in a sealed manner through the second blockers combined by the solder
Data Source
AI summary
The instant disclosure provides a self-sealed stacked structure which includes a substrate unit, a first frame, a conductive unit and a blocker unit. The substrate unit includes a first and a second substrate, and a first frame sandwiched there-between. The conductive unit includes a plurality of first conductors and second conductors electrically connecting the first substrate, the first frame and the second substrate. The first and the second conductors are in electrical connection. A blocker unit including at least two first and at least two second blockers are surroundingly arranged around the plurality of first and second conductors, respectively. The first substrate and the first frame are connected in a sealed manner through the first blockers combined by the solder, where the first frame and the second substrate are connected in a sealed manner through the second blockers combined by the solder.