Stacked Substrate Cutting With Adhesive Vibration Damping
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Solution Overview
Problem
Conventional substrate-cutting methods for flexible display devices often result in substrate damage due to vibrations during the cutting process.
Innovation Solution
A substrate-cutting method involving a substrate-stacking structure with an adhesive layer interposed between substrates, where the adhesive layer prevents friction and vibration between substrates during laser cutting, ensuring precise cutting without damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple substrates are cut simultaneously using a laser beam, then productivity is improved, but substrates may be damaged due to vibrations during the cutting process
Solution Approach 1:
An adhesive layer is introduced as an intermediary substance between adjacent substrates. This adhesive layer serves as a mediator that bonds the substrates together, forming a stable stacked structure that resists vibration during laser cutting. The adhesive layer transfers and distributes vibrational forces, preventing direct transmission between substrates that would cause damage, thereby enabling simultaneous cutting of multiple substrates while maintaining substrate integrity.
2Productivity
If substrates are stacked closely together for simultaneous cutting, then productivity is improved, but friction between substrates increases causing damage
Solution Approach 1:
The adhesive layer acts as a protective intermediary between substrates, replacing direct substrate-to-substrate contact with adhesive-to-substrate contact. This intermediary layer has controlled friction characteristics that prevent harmful friction forces from developing between the substrate surfaces during the cutting process, allowing substrates to be stacked closely for efficient mass production while eliminating friction-induced damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively prevents substrate damage by reducing friction and vibrations during cutting, thereby improving process efficiency and reliability in cutting multiple stacked substrates.
Implementation Method 1
cutting the second substrate along a second cutting line, where the second cutting line corresponds to a boundary between the second active areas and the second non-active area, using a laser beam
Implementation Method 2
the adhesive layer prevents friction and vibration between substrates during laser cutting
Data Source
AI summary
A substrate-cutting method includes preparing a first substrate in which a plurality of first active areas spaced apart from each other and a first non-active area surrounding the first active areas are defined in a plane, forming an adhesive layer on the first substrate where the adhesive layer is disposed within the first active areas, disposing a second substrate in which a plurality of second active areas spaced apart from each other and a second non-active area surrounding the second active areas are defined in the plane, and cutting a cutting line of the second substrate, which corresponds to a boundary between the second active areas and the second non-active area, using a laser beam. The adhesive layer does not overlap the cutting line of the second substrate.