Stacked Substrate Package Without Interposers for Warpage Control
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Solution Overview
Problem
In 2.5D or 3D stacking modules, the distance between boards is difficult to control, leading to potential warpage issues and improper connection of interposers, which can result in electrical shorts and reduced space for accommodating electronic components.
Innovation Solution
A semiconductor device package design that eliminates the need for interposers by using a multilayer structure with substrates stacked directly on top of each other, connected via bonded wires or vias that pass through openings in the substrates, ensuring proper electrical connection without the risk of shorts and providing more space for additional components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If interposers are used to connect two boards in 2.5D or 3D stacking modules, then electrical connection between boards is achieved, but the distance between boards becomes difficult to control and warpage issues occur
Solution Approach 1:
The patent removes the interposer component from the stacking module architecture. Instead of using an interposer to connect boards, the invention directly bonds semiconductor devices between substrates, eliminating the source of distance control issues and warpage problems while maintaining electrical connectivity.
Solution Approach 2:
The patent merges the functions of the interposer and the substrate by having semiconductor devices directly bonded to substrate surfaces. This integration eliminates the intermediate connection layer and reduces the overall stack height while improving distance control precision.
2Reliability
If interposers are used to connect boards, then electrical connection is provided, but warpage issues and improper connection occur
Solution Approach 1:
The patent extracts and removes the interposer component that causes warpage instability. By directly bonding semiconductor devices to substrates without an intermediate interposer layer, the system eliminates the structural source of warpage while maintaining reliable electrical connections.
3Reliability
If interposers are used for connection, then electrical connectivity is achieved, but space for accommodating electronic components is reduced
Solution Approach 1:
The patent removes the interposer component entirely, eliminating the space it occupies within the stacking module. This increases the available volume for accommodating additional electronic components and reduces the overall package size while maintaining electrical connectivity through direct substrate bonding.
Solution Approach 2:
The patent enables more efficient nesting of semiconductor devices within the substrate structure by eliminating the interposer layer. This allows for increased component density and better utilization of the available three-dimensional space in the stacking module.
Data Source
AI summary
A semiconductor device package and a method for manufacturing the semiconductor device package are provided. The semiconductor device package includes a first substrate, a second substrate and an interconnection. The second substrate is arranged above the first substrate and has an opening. The interconnection passes through the opening and connects to the first substrate and the second substrate.