Stacked Switch ICs for Compact High-Frequency Modules
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing high-frequency modules with switch elements mounted next to each other on a substrate face challenges in miniaturization due to large mounting areas and deteriorated isolation characteristics between communication signals, particularly when balanced terminals are arranged in different directions, leading to complex substrate shapes and intersecting signal patterns.
Innovation Solution
A high-frequency module configuration featuring a stacked arrangement of two switch ICs with same or similar pad electrode arrangements, connected via wire bonding to a substrate, allowing for a compact design and improved signal isolation by eliminating intersecting wiring patterns and utilizing adhesive for reliable mounting and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If switch elements are mounted next to each other on the substrate, then the switching function is achieved, but the mounting area becomes large
Solution Approach 1:
The patent transitions from a planar arrangement of switch elements to a three-dimensional stacked configuration. By mounting the second switch element on the surface of the first switch element perpendicular to the substrate, the solution utilizes the vertical dimension to reduce the mounting area on the substrate while maintaining the switching function.
2Adaptability or versatility
If balanced terminals are arranged in different directions on the substrate, then the switching capability is improved, but the wiring patterns intersect and isolation characteristic deteriorates
Solution Approach 1:
The patent resolves the wiring intersection problem by stacking switch elements vertically. The first and second switch elements are mounted on opposite surfaces of the substrate, allowing wiring patterns to be routed in the vertical dimension rather than intersecting on the same plane, thereby maintaining isolation characteristics while achieving versatile switching capability.
Solution Approach 2:
The second switch element is mounted on the surface of the first switch element, creating a nested configuration where one component is positioned within the space occupied by another. This nesting approach allows both switch elements to coexist without their wiring patterns intersecting, preserving signal isolation.
3Object-affected harmful factors
If wiring patterns are arranged to avoid intersection, then isolation characteristic is improved, but the substrate shape becomes complicated
Solution Approach 1:
By stacking switch elements vertically, the patent eliminates the need for complex substrate shape modifications. The wiring patterns can be简单地 routed on the substrate surfaces without intersection, as the vertical stacking provides the necessary spatial separation, keeping the substrate shape simple while maintaining isolation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the mounting area, enhances signal isolation, and simplifies the substrate design while maintaining balanced signal characteristics, achieving a compact and efficient high-frequency module with improved switching accuracy and balance.
Implementation Method 1
The individual pad electrodes and the land electrodes are connected to each other via wire bonding
Data Source
AI summary
A high-frequency module includes first and second switch IC elements and a substrate. The first and second switch IC elements are the same or substantially the same IC chips, and are mounted in the same or substantially the same orientation. The first switch IC element is mounted on the substrate. The second switch IC element is mounted above the first switch IC element. Due to wire bonding, the individual pad electrodes of the first and second switch IC elements are connected to the land electrodes of the substrate, which are to be connected to the individual pad electrodes. Between a pad electrode and a land electrode connected to each other, another land electrode is not provided.